Hard-pad-based CMP of premetal dielectric planarization

Hard-pad-based CMP of premetal dielectric planarization

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Veröffentlicht in:Journal of the Electrochemical Society 2003-08, Vol.150 (8), p.G450-G455
Hauptverfasser: KIM, Sam-Dong, HWANG, In-Seok, CHOI, Ki-Sik
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Sprache:eng
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Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Materials science
Physics
Surface treatments
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container_end_page G455
container_issue 8
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container_title Journal of the Electrochemical Society
container_volume 150
creator KIM, Sam-Dong
HWANG, In-Seok
CHOI, Ki-Sik
description
doi_str_mv 10.1149/1.1588302
format Article
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ispartof Journal of the Electrochemical Society, 2003-08, Vol.150 (8), p.G450-G455
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1945-7111
language eng
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source Institute of Physics Journals
subjects Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Materials science
Physics
Surface treatments
title Hard-pad-based CMP of premetal dielectric planarization
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