Removal of submicrometer particles from silicon wafer surfaces using HF-based Cleaning mixtures

Removal of submicrometer particles from silicon wafer surfaces using HF-based Cleaning mixtures

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Veröffentlicht in:Journal of the Electrochemical Society 2001, Vol.148 (12), p.G683-G691
Hauptverfasser: VOS, R, LUX, M, XU, K, FYEN, W, KENENS, C, CONARD, T, MERTENS, P, HEYNS, M, HATCHER, Z, HOFFMAN, M
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Sprache:eng
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Applied sciences
Electronics
Exact sciences and technology
Miscellaneous
Semiconductor devices
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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container_end_page G691
container_issue 12
container_start_page G683
container_title Journal of the Electrochemical Society
container_volume 148
creator VOS, R
LUX, M
XU, K
FYEN, W
KENENS, C
CONARD, T
MERTENS, P
HEYNS, M
HATCHER, Z
HOFFMAN, M
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doi_str_mv 10.1149/1.1413483
format Article
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ispartof Journal of the Electrochemical Society, 2001, Vol.148 (12), p.G683-G691
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source IOP Publishing Current Journals
subjects Applied sciences
Electronics
Exact sciences and technology
Miscellaneous
Semiconductor devices
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
title Removal of submicrometer particles from silicon wafer surfaces using HF-based Cleaning mixtures
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