In situ technique for dynamic fluid film pressure measurement during chemical mechanical polishing

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Veröffentlicht in:Journal of the Electrochemical Society 2000-07, Vol.147 (7), p.2741-2743
Hauptverfasser: BULLEN, D, SCARFO, A, KOCH, A, BRAMONO, D. P. Y, COPPETA, J, RACZ, L
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container_end_page 2743
container_issue 7
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container_title Journal of the Electrochemical Society
container_volume 147
creator BULLEN, D
SCARFO, A
KOCH, A
BRAMONO, D. P. Y
COPPETA, J
RACZ, L
description
doi_str_mv 10.1149/1.1393598
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ispartof Journal of the Electrochemical Society, 2000-07, Vol.147 (7), p.2741-2743
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1945-7111
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source IOP Publishing Journals
subjects Applied sciences
Electronics
Exact sciences and technology
Fluid dynamics
Fundamental areas of phenomenology (including applications)
Instrumentation for fluid dynamics
Mechanical engineering. Machine design
Microelectronic fabrication (materials and surfaces technology)
Physics
Precision engineering, watch making
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
title In situ technique for dynamic fluid film pressure measurement during chemical mechanical polishing
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