In situ technique for dynamic fluid film pressure measurement during chemical mechanical polishing
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Veröffentlicht in: | Journal of the Electrochemical Society 2000-07, Vol.147 (7), p.2741-2743 |
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container_issue | 7 |
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container_title | Journal of the Electrochemical Society |
container_volume | 147 |
creator | BULLEN, D SCARFO, A KOCH, A BRAMONO, D. P. Y COPPETA, J RACZ, L |
description | |
doi_str_mv | 10.1149/1.1393598 |
format | Article |
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ispartof | Journal of the Electrochemical Society, 2000-07, Vol.147 (7), p.2741-2743 |
issn | 0013-4651 1945-7111 |
language | eng |
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source | IOP Publishing Journals |
subjects | Applied sciences Electronics Exact sciences and technology Fluid dynamics Fundamental areas of phenomenology (including applications) Instrumentation for fluid dynamics Mechanical engineering. Machine design Microelectronic fabrication (materials and surfaces technology) Physics Precision engineering, watch making Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices |
title | In situ technique for dynamic fluid film pressure measurement during chemical mechanical polishing |
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