Cleaning efficiencies of various chemical solutions for noble metals such as Cu, Ag, and Au on Si wafer surfaces

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Bibliographische Detailangaben
Veröffentlicht in:	Journal of the Electrochemical Society 1999-11, Vol.146 (11), p.4281-4289
Hauptverfasser:	KIM, J.-S, MORITA, H, CHOI, G.-M, OHMID, T
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Cross-disciplinary physics: materials science rheology Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Integrated circuits Materials science Metals. Metallurgy Microelectronics: LSI, VLSI, ULSI integrated circuit fabrication technology Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Surface cleaning, etching, patterning Surface treatments
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