Advances in In-situ Boron and Phosphorous Doping of SiGeSn

Dopant concentrations higher than 1x10 19 cm -3 are required to improve the performances of various GeSn based devices such as photodetectors, electrically pumped lasers and so on. In this study, the in-situ Boron and Phosphorous doping of SiGeSn was investigated, building upon recent studies on in-situ B or P doped GeSn. The surfaces of intrinsic and lowly doped pseudomorphic SiGeSn layers were rough. By contrast, a cross hatch was recovered and surfaces as smooth as the Ge Strain-Relaxed Buffers underneath were obtained for the highest B 2 H 6 or PH 3 mass-flows. The surface Root Mean Square roughness and Z range values were then as low as 0.36 nm and 2.86 nm for SiGeSn:B, and 0.47 nm and 4.60 nm for SiGeSn:P. In addition, Si contents as high as 25% were obtained, notably in SiGeSn:B layers. Dopants were almost fully electrically active in those SiGeSn:B and SiGeSn:P layers, with carrier concentrations as high as 2.0x10 20 cm -3 and 2.7x10 20 cm -3 , respectively. For SiGeSn:P, the shortcoming of in-situ doped GeSn:P was overcome, that is the formation of electrically inactive Sn m P n V clusters for high PH 3 mass-flows. Such electrically active carrier concentrations will be beneficial for (Si)GeSn based devices, but also for all Group-IV based devices with extremely low thermal budget constraints.