(Invited) Monolithic Ge Integration on the 3 µm SOI Platform for 40 GHz Photodiodes

Ge photodiodes were integrated on the 3 µm SOI platform, where the 3 µm thick Si waveguides offer ultra-low propagation losses (~0.1 dB/cm), ultra-dense integration (μm-scale bends), small polarization dependency (down-to-zero birefringence) and the ability to tolerate relatively high optical powers...

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Veröffentlicht in:ECS transactions 2020-09, Vol.98 (5), p.303-313
Hauptverfasser: Aalto, Timo, Vehmas, Tapani, Kapulainen, Markku, Heimala, Päivi, Delrosso, Giovanni, Sun, Fei, Gao, Feng
Format: Artikel
Sprache:eng
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Zusammenfassung:Ge photodiodes were integrated on the 3 µm SOI platform, where the 3 µm thick Si waveguides offer ultra-low propagation losses (~0.1 dB/cm), ultra-dense integration (μm-scale bends), small polarization dependency (down-to-zero birefringence) and the ability to tolerate relatively high optical powers (>1W). A horizontal Ge PIN photodiode was monolithically integrated on the 3 µm SOI platform. It reached a 3 dB cutoff frequency of 40 GHz and 1.0 A/W responsivity at -1 V bias and 1.55 µm wavelength. Germanium was selectively grown into cavities in the 3 µm SOI layer and the Ge waveguide detector was patterned with the same hard mask with the Si waveguides to achieve waveguide self-alignment. The development of 40 GHz PDs was an important step in improving the feasibility of the 3 µm SOI platform in high-bandwidth applications.
ISSN:1938-5862
1938-6737
DOI:10.1149/09805.0303ecst