(Keynote) Low Temperature SmartCut TM Process for 3D Integration

(Keynote) Low Temperature SmartCut TM Process for 3D Integration

To support 3D Sequential integration with a cost-effective layer transfer, SmartCut™ process at low temperature (below 500 °C) is proposed. Excellent SOI & BOX layer thickness uniformities are demonstrated, while layer integrity, electron and hole mobility performances are already compliant with...

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Veröffentlicht in:ECS transactions 2020-04, Vol.97 (5), p.129-133
Hauptverfasser: Schwarzenbach, Walter, Reboh, Shay, Ghorbel, Aymen, Gaudin, Gweltaz, Besnard, Guillaume, Mazen, Frédéric, Loup, Virginie, Maitrejean, Sylvain, Brunet, Laurent, Nguyen, Bich-Yen, Maleville, Christophe
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Sprache:eng
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Zusammenfassung:To support 3D Sequential integration with a cost-effective layer transfer, SmartCut™ process at low temperature (below 500 °C) is proposed. Excellent SOI & BOX layer thickness uniformities are demonstrated, while layer integrity, electron and hole mobility performances are already compliant with development grade requirements.
ISSN:1938-5862
1938-6737
DOI:10.1149/09705.0129ecst