(Invited) Characteristics of a Wire-Bonding-Less SiC Power Module Operating in a Wide Temperature Range

Using high-speed switching, SiC power devices can reduce on-resistance in the on-state to realize low power converter losses. In addition, SiC power devices can be operated in high temperatures; thus, their cooling systems can be reduced in size or removed altogether, thereby increasing the power de...

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Veröffentlicht in:	ECS transactions 2015-09, Vol.69 (11), p.123-132
Hauptverfasser:	Sato, Shinji, Tanisawa, Hidekazu, Anzai, Takeshi, Takahashi, Hiroki, Murakami, Yoshinori, Kato, Fumiki, Watanabe, Kinuyo, Sato, Hiroshi
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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