(Invited) Impact of Size Scale on Electro-Chemo-Mechanical Coupling Properties in MIECs: Bulk and Thin Film (Pr,Ce)O 2-δ

The point defect induced strain and stress in thin films was analyzed using in situ wafer curvature and in-situ XRD measurements. The strains and stresses were modeled using a previously well-developed and experimentally validated point defect equilibria model. Values for the chemical expansion coef...

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Veröffentlicht in:ECS transactions 2014-03, Vol.61 (1), p.31-36
Hauptverfasser: Bishop, Sean R., Chen, Di, Sheth, Jay, Misture, Scott, Sheldon, Brian W., Kim, Jae Jin, Tuller, Harry L.
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container_issue 1
container_start_page 31
container_title ECS transactions
container_volume 61
creator Bishop, Sean R.
Chen, Di
Sheth, Jay
Misture, Scott
Sheldon, Brian W.
Kim, Jae Jin
Tuller, Harry L.
description The point defect induced strain and stress in thin films was analyzed using in situ wafer curvature and in-situ XRD measurements. The strains and stresses were modeled using a previously well-developed and experimentally validated point defect equilibria model. Values for the chemical expansion coefficient and Young’s modulus for bulk ceramics were successfully used to predict stress and strain behavior of the corresponding thin films.
doi_str_mv 10.1149/06101.0031ecst
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title (Invited) Impact of Size Scale on Electro-Chemo-Mechanical Coupling Properties in MIECs: Bulk and Thin Film (Pr,Ce)O 2-δ
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