(Invited) Impact of Size Scale on Electro-Chemo-Mechanical Coupling Properties in MIECs: Bulk and Thin Film (Pr,Ce)O 2-δ

(Invited) Impact of Size Scale on Electro-Chemo-Mechanical Coupling Properties in MIECs: Bulk and Thin Film (Pr,Ce)O 2-δ

The point defect induced strain and stress in thin films was analyzed using in situ wafer curvature and in-situ XRD measurements. The strains and stresses were modeled using a previously well-developed and experimentally validated point defect equilibria model. Values for the chemical expansion coef...

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Veröffentlicht in:ECS transactions 2014-03, Vol.61 (1), p.31-36
Hauptverfasser: Bishop, Sean R., Chen, Di, Sheth, Jay, Misture, Scott, Sheldon, Brian W., Kim, Jae Jin, Tuller, Harry L.
Format: Artikel
Sprache:eng
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Zusammenfassung:The point defect induced strain and stress in thin films was analyzed using in situ wafer curvature and in-situ XRD measurements. The strains and stresses were modeled using a previously well-developed and experimentally validated point defect equilibria model. Values for the chemical expansion coefficient and Young’s modulus for bulk ceramics were successfully used to predict stress and strain behavior of the corresponding thin films.
ISSN:1938-5862
1938-6737
DOI:10.1149/06101.0031ecst