(Invited) Low Temperature Direct Bonding 3D Stacking Technologies for High Density Device Integration

(Invited) Low Temperature Direct Bonding 3D Stacking Technologies for High Density Device Integration

3D integration aims at providing highly integrated systems by vertically stacking and connecting various materials, technologies, and functional components together. We will review the different approaches, using direct bonding, developed to address 3D devices manufacturing challenges.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Di Cioccio, Lea, Radu, Ionut, Gaudin, Gweltaz, Lacave, Thomas, Baudin, Floriane, Sadaka, Mariam, Signamarcheix, Thomas
Format: Tagungsbericht
Sprache:eng
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:3D integration aims at providing highly integrated systems by vertically stacking and connecting various materials, technologies, and functional components together. We will review the different approaches, using direct bonding, developed to address 3D devices manufacturing challenges.
ISSN:1938-5862
1938-6737
DOI:10.1149/05809.0017ecst