III-N High-Power Bipolar Transistors

We report state-of-the-art d.c. and RF performance of GaN/InGaN npn DHBTs grown by the MOCVD technology on sapphire substrates. The fabricated GaN/InGaN HBTs achieved a collector current density greater than 50 kA/cm2 and a d.c. current gain of 60 at the collector voltage of 13 V. A open-base collec...

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Veröffentlicht in:ECS transactions 2013-08, Vol.58 (4), p.261-267
Hauptverfasser: Dupuis, Russell D, Kim, Jeomoh, Lee, Yi-Che, Lochner, Zachary, Ji, Mi-Hee, Kao, Tsung-Ting, Ryou, Jae-Hyun, Detchphrom, Theeradetch, Shen, Shyh-Chiang
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Sprache:eng
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Zusammenfassung:We report state-of-the-art d.c. and RF performance of GaN/InGaN npn DHBTs grown by the MOCVD technology on sapphire substrates. The fabricated GaN/InGaN HBTs achieved a collector current density greater than 50 kA/cm2 and a d.c. current gain of 60 at the collector voltage of 13 V. A open-base collector-emitter breakdown voltage of greater than 90 V was measured. Using the same layer structure and device fabrication techniques, we also demonstrated state-of-the-art RF performance of GaN/InGaN HBTs with fT greater than 8 GHz and fmax greater than 1.8 GHz at the collector current density of 11 kA/cm2. These d.c. and RF measurement results demonstrated the capability and feasibility of III-N HBTs for high-power circuit applications.
ISSN:1938-5862
1938-6737
DOI:10.1149/05804.0261ecst