Thermally Stabilized Nickel Electro-Catalyst Introduced by Infiltration for High Temperature Electrochemical Energy Conversion

This report examines the use of aluminum titanate (ALT) as a means of stabilizing nickel electro-catalyst networks against thermally-induced coarsening. While this novel technology has potentially widespread application, focus is placed on the stabilization of nano-nickel particulate introduced by infiltration techniques into YSZ scaffolds for SOFCs. Here, the implementation of ALT is applied specifically through infiltration in the same manner as the nickel catalyst. The efficacy of this system is quantified through high-temperature conductivity testing of nickel networks supported through modeling and electrochemical tests which include an investigation of varied nickel loading within the SOFC anode. The ALT anchoring system continues to show great promise with degradation significantly impeded when compared to non-anchored samples.