Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards

Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards

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Veröffentlicht in:Japanese Journal of Applied Physics 2008-05, Vol.47 (5S), p.4300
Hauptverfasser: Lee, Jong-Bum, Koo, Ja-Myeong, Hong, Soon-Min, Shin, Hyoyoung, Moon, Young-jun, Jung, Jae-Pil, Yoo, Choong-Don, Jung, Seung-Boo
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container_issue 5S
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container_title Japanese Journal of Applied Physics
container_volume 47
creator Lee, Jong-Bum
Koo, Ja-Myeong
Hong, Soon-Min
Shin, Hyoyoung
Moon, Young-jun
Jung, Jae-Pil
Yoo, Choong-Don
Jung, Seung-Boo
description
doi_str_mv 10.1143/JJAP.47.4300
format Article
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source IOP Publishing Journals; Institute of Physics (IOP) Journals - HEAL-Link
title Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards
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