Nitride based Power Chip with Indium-Tin-Oxide p-Contact and Al Back-Side Reflector
Nitride-based large size (i.e. 1 mm×1 mm) indium-tin-oxide (ITO) light emitting diodes (LEDs) were successfully fabricated. In order to enhance the output intensity of power chips, Al reflector was deposited by e-beam evaporator on the chip backside. It was found that the 350 mA output power was 84....
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Veröffentlicht in: | Japanese Journal of Applied Physics 2005-04, Vol.44 (4S), p.2462 |
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container_issue | 4S |
container_start_page | 2462 |
container_title | Japanese Journal of Applied Physics |
container_volume | 44 |
creator | Chang, Chia-Sheng Chang, Shoou-Jinn Su, Yan-Kuin Chen, Wei-Shou Shen, Chien-Fu Shei, Shih-Chang Lo, Hsin-Ming |
description | Nitride-based large size (i.e. 1 mm×1 mm) indium-tin-oxide (ITO) light emitting diodes (LEDs) were successfully fabricated. In order to enhance the output intensity of power chips, Al reflector was deposited by e-beam evaporator on the chip backside. It was found that the 350 mA output power was 84.8 mW (W-P-E=7.2%) at 460 nm for the power chip with ITO as p-contacts and Al as back-side reflector. It was also found that ITO power chip with Al reflector was more reliable. |
doi_str_mv | 10.1143/JJAP.44.2462 |
format | Article |
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In order to enhance the output intensity of power chips, Al reflector was deposited by e-beam evaporator on the chip backside. It was found that the 350 mA output power was 84.8 mW (W-P-E=7.2%) at 460 nm for the power chip with ITO as p-contacts and Al as back-side reflector. It was also found that ITO power chip with Al reflector was more reliable.</description><identifier>ISSN: 0021-4922</identifier><identifier>EISSN: 1347-4065</identifier><identifier>DOI: 10.1143/JJAP.44.2462</identifier><language>eng</language><ispartof>Japanese Journal of Applied Physics, 2005-04, Vol.44 (4S), p.2462</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c301t-f4a3fbaab0c7c3cb17396b8391a3c09a8b94bbce5ca931c9116f12544ef78ec83</citedby><cites>FETCH-LOGICAL-c301t-f4a3fbaab0c7c3cb17396b8391a3c09a8b94bbce5ca931c9116f12544ef78ec83</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>Chang, Chia-Sheng</creatorcontrib><creatorcontrib>Chang, Shoou-Jinn</creatorcontrib><creatorcontrib>Su, Yan-Kuin</creatorcontrib><creatorcontrib>Chen, Wei-Shou</creatorcontrib><creatorcontrib>Shen, Chien-Fu</creatorcontrib><creatorcontrib>Shei, Shih-Chang</creatorcontrib><creatorcontrib>Lo, Hsin-Ming</creatorcontrib><title>Nitride based Power Chip with Indium-Tin-Oxide p-Contact and Al Back-Side Reflector</title><title>Japanese Journal of Applied Physics</title><description>Nitride-based large size (i.e. 1 mm×1 mm) indium-tin-oxide (ITO) light emitting diodes (LEDs) were successfully fabricated. In order to enhance the output intensity of power chips, Al reflector was deposited by e-beam evaporator on the chip backside. It was found that the 350 mA output power was 84.8 mW (W-P-E=7.2%) at 460 nm for the power chip with ITO as p-contacts and Al as back-side reflector. 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In order to enhance the output intensity of power chips, Al reflector was deposited by e-beam evaporator on the chip backside. It was found that the 350 mA output power was 84.8 mW (W-P-E=7.2%) at 460 nm for the power chip with ITO as p-contacts and Al as back-side reflector. It was also found that ITO power chip with Al reflector was more reliable.</abstract><doi>10.1143/JJAP.44.2462</doi></addata></record> |
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title | Nitride based Power Chip with Indium-Tin-Oxide p-Contact and Al Back-Side Reflector |
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