Mg/Si(100) Reconstructions Studied by Scanning Tunneling Microscopy

Using scanning tunneling microscopy (STM), the behavior of Mg submonolayers on a Si(100)2×1 surface has been studied during deposition at room temperature (RT) and upon annealing at 250°C and 400°C. RT-deposited Mg forms meandering chains of features that run roughly perpendicular to the substrate S...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Japanese Journal of Applied Physics 2000-06, Vol.39 (6S), p.3740
Hauptverfasser: A. Saranin, Osamu Kubo, V. Zotov, Andrey, Toru Harada, Toru Harada, Tadashi Kobayashi, Tadashi Kobayashi, Nobumitsu Yamaoka, Nobumitsu Yamaoka, Jeong-Tak Ryu, Jeong-Tak Ryu, Mitsuhiro Katayama, Mitsuhiro Katayama, Kenjiro Oura, Kenjiro Oura
Format: Artikel
Sprache:eng
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Using scanning tunneling microscopy (STM), the behavior of Mg submonolayers on a Si(100)2×1 surface has been studied during deposition at room temperature (RT) and upon annealing at 250°C and 400°C. RT-deposited Mg forms meandering chains of features that run roughly perpendicular to the substrate Si dimer rows and, at saturation, tend to form the arrays of the 2×2 reconstruction. Annealing at 250°C transforms the chains to random groups of Mg clusters. Subsequent annealing at 400°C induces Si redistribution at the surface and results in the formation of straight chains of features that are again aligned perpendicular to the Si dimer rows. These high-temperature (HT) features are plausibly composed of 1 Si atom and 1–2 Mg atoms. The spacing of the HT features within the chain is 2 a ( a =3.84 Å) and stacking of the chains produces the domains of 2×2, 2×3 and other 2× n reconstructions. At saturation, almost the entire surface is occupied by the 2×2 reconstruction. At higher Mg coverages, the growth of a silicide occurs both at RT deposition and upon annealing.
ISSN:0021-4922
1347-4065
DOI:10.1143/JJAP.39.3740