Fabrication of a Silicon Micro-Probe for Vertical Probe Card Application
We report on the fabrication of a new type of probe card that uses a porous silicon micromachining technique. Curled cantilever tips are fabricated using surface tension and the difference in the thermal expansion coefficient between the films. The contact resistance of cantilever tips with an alumi...
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| Veröffentlicht in: | Japanese Journal of Applied Physics 1998-12, Vol.37 (12S), p.7070 |
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| container_issue | 12S |
| container_start_page | 7070 |
| container_title | Japanese Journal of Applied Physics |
| container_volume | 37 |
| creator | Kim, Yong-Dae Sim, Jun-Hwan Nam, Jae-Woo Lee, Jong-Hyun |
| description | We report on the fabrication of a new type of probe card that uses a porous silicon micromachining
technique. Curled cantilever tips are fabricated using surface tension and the difference in the thermal
expansion coefficient between the films. The contact resistance of cantilever tips with an aluminum pad is
basically below 1 Ω and there is no change of contact resistance after 700,000 contacts. |
| doi_str_mv | 10.1143/JJAP.37.7070 |
| format | Article |
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expansion coefficient between the films. The contact resistance of cantilever tips with an aluminum pad is
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technique. Curled cantilever tips are fabricated using surface tension and the difference in the thermal
expansion coefficient between the films. The contact resistance of cantilever tips with an aluminum pad is
basically below 1 Ω and there is no change of contact resistance after 700,000 contacts.</abstract><doi>10.1143/JJAP.37.7070</doi></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0021-4922 |
| ispartof | Japanese Journal of Applied Physics, 1998-12, Vol.37 (12S), p.7070 |
| issn | 0021-4922 1347-4065 |
| language | eng |
| recordid | cdi_crossref_primary_10_1143_JJAP_37_7070 |
| source | IOP Publishing Journals; Institute of Physics (IOP) Journals - HEAL-Link |
| title | Fabrication of a Silicon Micro-Probe for Vertical Probe Card Application |
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