Fabrication of a Silicon Micro-Probe for Vertical Probe Card Application

We report on the fabrication of a new type of probe card that uses a porous silicon micromachining technique. Curled cantilever tips are fabricated using surface tension and the difference in the thermal expansion coefficient between the films. The contact resistance of cantilever tips with an alumi...

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Veröffentlicht in:Japanese Journal of Applied Physics 1998-12, Vol.37 (12S), p.7070
Hauptverfasser: Kim, Yong-Dae, Sim, Jun-Hwan, Nam, Jae-Woo, Lee, Jong-Hyun
Format: Artikel
Sprache:eng
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Zusammenfassung:We report on the fabrication of a new type of probe card that uses a porous silicon micromachining technique. Curled cantilever tips are fabricated using surface tension and the difference in the thermal expansion coefficient between the films. The contact resistance of cantilever tips with an aluminum pad is basically below 1 Ω and there is no change of contact resistance after 700,000 contacts.
ISSN:0021-4922
1347-4065
DOI:10.1143/JJAP.37.7070