Fabrication Procedures and Characteristics of 6H-SiC Au-gate Metal-Semiconductor Field-Effect Transistor for Use at High Temperatures
A 6H-SiC Au-gate metal-semiconductor field-effect transistor (MESFET) was fabricated by reactive ion etching (RIE) for device isolation and ion implantation for the n + contact regions of the source and drain. The device exhibited a pinch-off voltage of -9 V, transconductance ( g m ) of 5.3 mS/mm, a...
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Veröffentlicht in: | Japanese Journal of Applied Physics 1998, Vol.37 (4R), p.1817 |
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Hauptverfasser: | , , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
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Zusammenfassung: | A 6H-SiC Au-gate metal-semiconductor field-effect transistor (MESFET) was fabricated by reactive ion etching (RIE) for device isolation and ion implantation for the n
+
contact regions of the source and drain. The device exhibited a pinch-off voltage of -9 V, transconductance (
g
m
) of 5.3 mS/mm, and gate breakdown voltage of -200 V. The characteristics of the MESFET were investigated at high temperatures. This MESFET can be operated at 400°C. |
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ISSN: | 0021-4922 1347-4065 |
DOI: | 10.1143/JJAP.37.1817 |