Oscillating chemical instabilities in contact etching diagnosed by optical emission

This paper reports the observed optical emission during the plasma etching in a surface wave plasma tool (SWP). In these experiments, the gas flow was increased at constant pressure. The optical emission had a characteristic periodic behavior. As the gas flow is increased, the period decreased and t...

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Veröffentlicht in:Japanese Journal of Applied Physics 1997-04, Vol.36 (4B), p.2464-2469
1. Verfasser: MCNEVIN, S. C
Format: Artikel
Sprache:eng
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Zusammenfassung:This paper reports the observed optical emission during the plasma etching in a surface wave plasma tool (SWP). In these experiments, the gas flow was increased at constant pressure. The optical emission had a characteristic periodic behavior. As the gas flow is increased, the period decreased and the amplitude increased. It will be shown that these optical emission oscillations interfere with endpoint detection for
ISSN:0021-4922
1347-4065
DOI:10.1143/JJAP.36.2464