Development of biaxially stretched film for flexible printed circuit boards

A biaxially stretched film of BEK, a new engineering plastic with high heat resistance ( T g : 181° C, T m : 364° C) and chemical resistance, was developed as a base film for flexible printed circuit boards. Its heat shrinkage percentage at 260° C and the coefficient of thermal expansion below T g w...

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Veröffentlicht in:	Japanese Journal of Applied Physics 1995, Vol.34 (9A), p.4880-4883
Hauptverfasser:	SHIROUZU, S, ISHII, T, IGA, T, CHINO, S, HAYASI, M, TOMIOKA, T, SIBASAKI, S, ARAI, Y, OOKI, Y, HAYASHI, K
Format:	Artikel
Sprache:	eng
Schlagworte:	Application fields Applied sciences Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Polymer industry, paints, wood Technology of polymers
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Beschreibung
Zusammenfassung:	A biaxially stretched film of BEK, a new engineering plastic with high heat resistance ( T g : 181° C, T m : 364° C) and chemical resistance, was developed as a base film for flexible printed circuit boards. Its heat shrinkage percentage at 260° C and the coefficient of thermal expansion below T g were decreased to below 0.1%, and 3.3×10 -5 /° C, respectively. The process of determining stretching and heat setting conditions for film formation with a role stretcher and a tenter is reported.
ISSN:	0021-4922 1347-4065
DOI:	10.1143/jjap.34.4880