New Epoxy-Imide Resin

N , N '-Diglycidyl-1,3-bis(carboxymethylestersulfoimide) of 2-hydroxypropyl saccharin-6-carboxylic acid is obtained by interaction of dipotassium salt of 2-hydroxypropyl-1,3-bis(carboxymethylestersulfoimide) of saccharin-6-carboxylic acid with epichlorohydrin. The structure of the epoxy-imide compound is confirmed by the data of IR spectroscopy. A thermostable hot-curing epoxy-imide composition is made on the basis of the obtained resin. A composition based on an ED-20 epoxydiane resin is also made for comparative estimation of the heat resistance of the obtained oligomer. The curing process of the composition is studied by differential thermal analysis on a derivatograph of the Paulik–Paulik–Erdey system. It is found that the degree of cure of the obtained composition under the optimal regime of curing reaches 82%. It is determined that the composite material based on the epoxy-imide resin is characterized by sufficiently high thermal indices in comparison with materials based on an ED-20 resin and can replace them in those areas where heat-resistant epoxy compounds are needed and can also be used to produce heat-resistant epoxy adhesives and coatings.