Organosiloxane adhesive sealants with improved physicomechanical properties

Polyorganosiloxane compounds with improved physicomechanical properties are presented. The possibility of changing the properties of adhesive sealants by introducing them into the composition of new modifying additions, structure-forming additions (QM-resins), curing accelerators, and coupling agent...

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Veröffentlicht in:	Polymer science. Series D, Glues and sealing materials Glues and sealing materials, 2010, Vol.3 (3), p.198-200
Hauptverfasser:	Chigorina, E. A., Arutyunyants, A. A., Bestaev, M. V., Chigorina, T. M., Abaev, V. T.
Format:	Artikel
Sprache:	eng
Schlagworte:	Chemistry Chemistry and Materials Science Polymer Sciences
Online-Zugang:	Volltext
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Beschreibung
Zusammenfassung:	Polyorganosiloxane compounds with improved physicomechanical properties are presented. The possibility of changing the properties of adhesive sealants by introducing them into the composition of new modifying additions, structure-forming additions (QM-resins), curing accelerators, and coupling agents has been shown. The elaborated compounds can be recommended for sealing semiconductor devices and integral schemes.
ISSN:	1995-4212 1995-4220
DOI:	10.1134/S1995421210030093