Equipment for analysis of deformation characteristics of MEMS devices

Equipment on the basis of a CMOS video camera for analyzing deformations of mobile elements of microelectromechanical devices with dimensions ranging from hundreds of microns to several millimeters within a temperature range of 103–423 K in the presence of external perturbing factors in the form of an applied load or electric pulses is described. The possibility of the setup of determining the parameters of the angular displacements of experimental specimens with dimensions of the deformed region of 0.24–9.8 mm with an absolute error of no worse than 0.11° and an applied load with a relative error of up to 2.3% in a range of 10 -5 -10 -2 N is demonstrated. The results of the research consist in direct and inverse dependences: “load—deformation,” “temperature—deformation,” and “signal–deformation,” which characterize the object-motion kinematics in statics and dynamics at a frequency of up to 50 measurements/s. The equipment is used in both the manual mode, when objects of different types are studied, and a semiautomatic mode, if similar objects are studied.