Modification of the copper slab surface submicrorelief by applying high-density electric current
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| Veröffentlicht in: | Technical physics 2004-04, Vol.49 (4), p.516-519 |
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| Format: | Artikel |
| Sprache: | eng |
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| container_end_page | 519 |
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| container_issue | 4 |
| container_start_page | 516 |
| container_title | Technical physics |
| container_volume | 49 |
| creator | Shcherbakov, I. P. Churaev, D. V. Svetlov, V. N. |
| description | |
| doi_str_mv | 10.1134/1.1736927 |
| format | Article |
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| fulltext | fulltext |
| identifier | ISSN: 1063-7842 |
| ispartof | Technical physics, 2004-04, Vol.49 (4), p.516-519 |
| issn | 1063-7842 1090-6525 |
| language | eng |
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| source | SpringerLink Journals - AutoHoldings |
| title | Modification of the copper slab surface submicrorelief by applying high-density electric current |
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