Sideband peak count-index technique for monitoring multiple cracks in plate structures using ordinary state-based peri-ultrasound theory

This work presents a peri-ultrasound theory based on ordinary state-based peridynamics for modeling elastic waves propagating in three-dimensional (3-D) plate structures and interacting with multiple cracks. A recently developed nonlinear ultrasonic technique called sideband peak count-index (or SPC...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:The Journal of the Acoustical Society of America 2022-11, Vol.152 (5), p.3035-3048
Hauptverfasser: Zhang, Guangdong, Li, Xiongbing, Zhang, Shuzeng, Kundu, Tribikram
Format: Artikel
Sprache:eng
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:This work presents a peri-ultrasound theory based on ordinary state-based peridynamics for modeling elastic waves propagating in three-dimensional (3-D) plate structures and interacting with multiple cracks. A recently developed nonlinear ultrasonic technique called sideband peak count-index (or SPC-I) is adopted for monitoring one or more cracks with thickness values equal to 0 mm (crack-free), 1, 2, and 4 mm. Three separate scenarios—one crack, two cracks, and four cracks in 3-D plate structures—are investigated. These cracks can be classified as thin and thick cracks depending on the horizon size, which is mentioned in peri-ultrasound theory. Computed results for all three cases show larger SPC-I values for thin cracks than for thick cracks and the case of no cracks. This observation is in line with the previously reported results in the literature and proves that the state-based peri-ultrasound theory can capture the expected nonlinear response of elastic waves interacting with multiple cracks without changing the cracks' surface locations artificially, and this is always needed in most of the other numerical methods. The proposed state-based peri-ultrasound theory is more flexible and reliable for solving 3-D problems, and the out-of-plane wave field can be obtained for engineering analysis.
ISSN:0001-4966
1520-8524
DOI:10.1121/10.0015242