Charge retention phenomena in CT silicon nitride: Impact of technology and operating conditions

The aim of this work is to understand charge loss mechanisms in TANOS stack for which charge retention is monitored just after programming in an almost continuous way and voltage is applied during retention experiments in order to obtain zero electric field either on alumina or tunnel oxide. The cha...

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Veröffentlicht in:Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena Microelectronics and nanometer structures processing, measurement and phenomena, 2011-01, Vol.29 (1), p.1
Hauptverfasser: Ghidini, G., Galbiati, N., Mascellino, E., Scozzari, C., Sebastiani, A., Amoroso, S., Compagnoni, C. Monzio, Spinelli, A. S., Maconi, A., Piagge, R., Del Vitto, A., Alessandri, M., Baldi, I., Moltrasio, E., Albini, G., Grossi, A., Tessariol, P., Camerlenghi, E., Mauri, A.
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Sprache:eng
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Zusammenfassung:The aim of this work is to understand charge loss mechanisms in TANOS stack for which charge retention is monitored just after programming in an almost continuous way and voltage is applied during retention experiments in order to obtain zero electric field either on alumina or tunnel oxide. The charge loss mechanisms in TANOS stack can be a quite complicated process: An initial fast DT from interface traps localized at SiN/alumina interface, followed by charge loss through alumina from bulk traps in SiN which influences charge redistribution towards the tunnel oxide, observed only in Si-rich SiN. Programming voltage and stack composition impact trapped charge localization and hence charge redistribution and charge loss, even if the same initial Vfb is considered in charge retention experiments. While the charge loss through tunnel oxide is a DT, the charge loss through alumina depends on temperature and it is the main component of the charge loss in retention experiments for longer time.
ISSN:1071-1023
2166-2746
1520-8567
2166-2754
DOI:10.1116/1.3532541