Gd silicate: A high- k dielectric compatible with high temperature annealing

The authors report on the investigation of amorphous Gd-based silicates as high- k dielectrics. Two different stacks of amorphous gadolinium oxide ( Gd 2 O 3 ) and silicon oxide ( Si O 2 ) on silicon substrates are compared after annealing at temperatures up to 1000 ° C . Subsequently formed metal o...

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Veröffentlicht in:Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena Microelectronics and nanometer structures processing, measurement and phenomena, 2009-01, Vol.27 (1), p.249-252
Hauptverfasser: Gottlob, H. D. B., Stefani, A., Schmidt, M., Lemme, M. C., Kurz, H., Mitrovic, I. Z., Werner, M., Davey, W. M., Hall, S., Chalker, P. R., Cherkaoui, K., Hurley, P. K., Piscator, J., Engström, O., Newcomb, S. B.
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Sprache:eng
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Zusammenfassung:The authors report on the investigation of amorphous Gd-based silicates as high- k dielectrics. Two different stacks of amorphous gadolinium oxide ( Gd 2 O 3 ) and silicon oxide ( Si O 2 ) on silicon substrates are compared after annealing at temperatures up to 1000 ° C . Subsequently formed metal oxide semiconductor capacitors show a significant reduction in the capacitance equivalent thicknesses after annealing. Transmission electron microscopy, medium energy ion scattering, and x-ray diffraction analysis reveal distinct structural changes such as consumption of the Si O 2 layer and formation of amorphous Gd silicate. The controlled formation of Gd silicates in this work indicates a route toward high- k dielectrics compatible with conventional, gate first complementary metal-oxide semiconductor integration schemes.
ISSN:1071-1023
1520-8567
2166-2754
2166-2746
1520-8567
DOI:10.1116/1.3025904