High-resolution three-dimensional reconstruction: A combined scanning electron microscope and focused ion-beam approach

The ability to obtain three-dimensional information has always been important to gain insight and understanding into material systems. Three-dimensional reconstruction often reveals information about the morphology and composition of a system that can otherwise be obscured or misinterpreted by two-d...

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Veröffentlicht in:Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena Microelectronics and nanometer structures processing, measurement and phenomena, 2006-03, Vol.24 (2), p.554-561
Hauptverfasser: Bansal, R. K., Kubis, A., Hull, R., Fitz-Gerald, J. M.
Format: Artikel
Sprache:eng
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Zusammenfassung:The ability to obtain three-dimensional information has always been important to gain insight and understanding into material systems. Three-dimensional reconstruction often reveals information about the morphology and composition of a system that can otherwise be obscured or misinterpreted by two-dimensional images. In this article, we describe tomographic measurements with 10 nm scale resolution, combining focused ion-beam processing with field-emission scanning electron microscopy to obtain a series of high-resolution two-dimensional cross-sectional images. The images were then concatenated in a computer and interpolated into three-dimensional space to assess and visualize the structure of the material. The results of this research demonstrate the use of tomographic reconstruction of Si – Si ∕ Ge and θ ′ Al 2 Cu samples to reproduce the three-dimensional morphology with sub- 10 nm resolution.
ISSN:1071-1023
1520-8567
DOI:10.1116/1.2167987