High-resolution three-dimensional reconstruction: A combined scanning electron microscope and focused ion-beam approach
The ability to obtain three-dimensional information has always been important to gain insight and understanding into material systems. Three-dimensional reconstruction often reveals information about the morphology and composition of a system that can otherwise be obscured or misinterpreted by two-d...
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Veröffentlicht in: | Journal of vacuum science & technology. B, Microelectronics and nanometer structures processing, measurement and phenomena Microelectronics and nanometer structures processing, measurement and phenomena, 2006-03, Vol.24 (2), p.554-561 |
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Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
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Zusammenfassung: | The ability to obtain three-dimensional information has always been important to gain insight and understanding into material systems. Three-dimensional reconstruction often reveals information about the morphology and composition of a system that can otherwise be obscured or misinterpreted by two-dimensional images. In this article, we describe tomographic measurements with
10
nm
scale resolution, combining focused ion-beam processing with field-emission scanning electron microscopy to obtain a series of high-resolution two-dimensional cross-sectional images. The images were then concatenated in a computer and interpolated into three-dimensional space to assess and visualize the structure of the material. The results of this research demonstrate the use of tomographic reconstruction of
Si
–
Si
∕
Ge
and
θ
′
Al
2
Cu
samples to reproduce the three-dimensional morphology with sub-
10
nm
resolution. |
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ISSN: | 1071-1023 1520-8567 |
DOI: | 10.1116/1.2167987 |