Influence of Laser Soldering Temperatures on Through-Hole Component

Influence of Laser Soldering Temperatures on Through-Hole Component

The conventional method of selective soldering has been practiced using wave soldering, convection reflow, and hand soldering. However, due to industry automation and high demand for quality, repeatability and flexibility, laser soldering process has been developed to meet these demands. This articl...

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Veröffentlicht in:Journal of electronic packaging 2022-12, Vol.144 (4)
Hauptverfasser: Zahiri, Saifulmajdy A., Abas, Aizat, Sharif, M. F. M., Che Ani, Fakhrozi
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container_title Journal of electronic packaging
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creator Zahiri, Saifulmajdy A.
Abas, Aizat
Sharif, M. F. M.
Che Ani, Fakhrozi
description The conventional method of selective soldering has been practiced using wave soldering, convection reflow, and hand soldering. However, due to industry automation and high demand for quality, repeatability and flexibility, laser soldering process has been developed to meet these demands. This article investigates the effect of different temperature of laser soldering process on lead-free solder (SAC305) by means of numerical method that is validated by experiment. Finite volume method (FVM) was used for the three-dimensional simulation to simulate the filling flow of the lead-free solder. Experiments were carried out to complement simulation validity and the results of both methods show good agreement. The findings show that a better result can be achieved when the angle of component lead (θle) approaches 90 deg. Using optimized lead angle, five different temperature simulations were set in the range of 550 K 
doi_str_mv 10.1115/1.4052175
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fullrecord <record><control><sourceid>asme_cross</sourceid><recordid>TN_cdi_crossref_primary_10_1115_1_4052175</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1115895</sourcerecordid><originalsourceid>FETCH-LOGICAL-a250t-6d7469f86eef01872eee1cc85d6305f83c04b6210c6aeb07a2655ce609d51ea23</originalsourceid><addsrcrecordid>eNotjztPwzAUhS0EEqUwsDNkZUi51684I4qAVqrEQJkj17nuQ4ld2c3Av6fQTucMn47Ox9gjwgwR1QvOJCiOlbpiE1TclDVIeX3qIEVZidrcsruc9wAohNQT1iyC70cKjoroi6XNlIqv2HeUdmFTrGg4ULLHMVEuYihW2xTHzbacx56KJg6HGCgc79mNt32mh0tO2ff726qZl8vPj0XzuiwtV3AsdVdJXXujiTygqTgRoXNGdVqA8kY4kGvNEZy2tIbKcq2UIw11p5AsF1P2fN51KeacyLeHtBts-mkR2j_7FtuL_Yl9OrM2D9Tu45jC6do_ZWolfgG6Q1UY</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Influence of Laser Soldering Temperatures on Through-Hole Component</title><source>Alma/SFX Local Collection</source><source>ASME Transactions Journals (Current)</source><creator>Zahiri, Saifulmajdy A. ; Abas, Aizat ; Sharif, M. F. M. ; Che Ani, Fakhrozi</creator><creatorcontrib>Zahiri, Saifulmajdy A. ; Abas, Aizat ; Sharif, M. F. M. ; Che Ani, Fakhrozi</creatorcontrib><description>The conventional method of selective soldering has been practiced using wave soldering, convection reflow, and hand soldering. However, due to industry automation and high demand for quality, repeatability and flexibility, laser soldering process has been developed to meet these demands. This article investigates the effect of different temperature of laser soldering process on lead-free solder (SAC305) by means of numerical method that is validated by experiment. Finite volume method (FVM) was used for the three-dimensional simulation to simulate the filling flow of the lead-free solder. Experiments were carried out to complement simulation validity and the results of both methods show good agreement. The findings show that a better result can be achieved when the angle of component lead (θle) approaches 90 deg. Using optimized lead angle, five different temperature simulations were set in the range of 550 K &lt; T &lt; 700 K. The finding shows that 600 K has the best velocity and pressure distributions with average values of 63.3 mm/s and 101.13 kPa, respectively. The high-pressure regions are concentrated at the top and bottom surface of solder pad. High difference in pressure and velocity spots somehow lead to issue associated with possibility of incomplete filling or void formation. 650 K model shows less void formation since it produces high pressure filling flow within the solder region.</description><identifier>ISSN: 1043-7398</identifier><identifier>EISSN: 1528-9044</identifier><identifier>DOI: 10.1115/1.4052175</identifier><language>eng</language><publisher>ASME</publisher><ispartof>Journal of electronic packaging, 2022-12, Vol.144 (4)</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-a250t-6d7469f86eef01872eee1cc85d6305f83c04b6210c6aeb07a2655ce609d51ea23</citedby><cites>FETCH-LOGICAL-a250t-6d7469f86eef01872eee1cc85d6305f83c04b6210c6aeb07a2655ce609d51ea23</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,27901,27902,38497</link.rule.ids></links><search><creatorcontrib>Zahiri, Saifulmajdy A.</creatorcontrib><creatorcontrib>Abas, Aizat</creatorcontrib><creatorcontrib>Sharif, M. F. M.</creatorcontrib><creatorcontrib>Che Ani, Fakhrozi</creatorcontrib><title>Influence of Laser Soldering Temperatures on Through-Hole Component</title><title>Journal of electronic packaging</title><addtitle>J. Electron. Packag</addtitle><description>The conventional method of selective soldering has been practiced using wave soldering, convection reflow, and hand soldering. However, due to industry automation and high demand for quality, repeatability and flexibility, laser soldering process has been developed to meet these demands. This article investigates the effect of different temperature of laser soldering process on lead-free solder (SAC305) by means of numerical method that is validated by experiment. Finite volume method (FVM) was used for the three-dimensional simulation to simulate the filling flow of the lead-free solder. Experiments were carried out to complement simulation validity and the results of both methods show good agreement. The findings show that a better result can be achieved when the angle of component lead (θle) approaches 90 deg. Using optimized lead angle, five different temperature simulations were set in the range of 550 K &lt; T &lt; 700 K. The finding shows that 600 K has the best velocity and pressure distributions with average values of 63.3 mm/s and 101.13 kPa, respectively. The high-pressure regions are concentrated at the top and bottom surface of solder pad. High difference in pressure and velocity spots somehow lead to issue associated with possibility of incomplete filling or void formation. 650 K model shows less void formation since it produces high pressure filling flow within the solder region.</description><issn>1043-7398</issn><issn>1528-9044</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2022</creationdate><recordtype>article</recordtype><recordid>eNotjztPwzAUhS0EEqUwsDNkZUi51684I4qAVqrEQJkj17nuQ4ld2c3Av6fQTucMn47Ox9gjwgwR1QvOJCiOlbpiE1TclDVIeX3qIEVZidrcsruc9wAohNQT1iyC70cKjoroi6XNlIqv2HeUdmFTrGg4ULLHMVEuYihW2xTHzbacx56KJg6HGCgc79mNt32mh0tO2ff726qZl8vPj0XzuiwtV3AsdVdJXXujiTygqTgRoXNGdVqA8kY4kGvNEZy2tIbKcq2UIw11p5AsF1P2fN51KeacyLeHtBts-mkR2j_7FtuL_Yl9OrM2D9Tu45jC6do_ZWolfgG6Q1UY</recordid><startdate>20221201</startdate><enddate>20221201</enddate><creator>Zahiri, Saifulmajdy A.</creator><creator>Abas, Aizat</creator><creator>Sharif, M. F. M.</creator><creator>Che Ani, Fakhrozi</creator><general>ASME</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20221201</creationdate><title>Influence of Laser Soldering Temperatures on Through-Hole Component</title><author>Zahiri, Saifulmajdy A. ; Abas, Aizat ; Sharif, M. F. M. ; Che Ani, Fakhrozi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-a250t-6d7469f86eef01872eee1cc85d6305f83c04b6210c6aeb07a2655ce609d51ea23</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2022</creationdate><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Zahiri, Saifulmajdy A.</creatorcontrib><creatorcontrib>Abas, Aizat</creatorcontrib><creatorcontrib>Sharif, M. F. M.</creatorcontrib><creatorcontrib>Che Ani, Fakhrozi</creatorcontrib><collection>CrossRef</collection><jtitle>Journal of electronic packaging</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Zahiri, Saifulmajdy A.</au><au>Abas, Aizat</au><au>Sharif, M. F. M.</au><au>Che Ani, Fakhrozi</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Influence of Laser Soldering Temperatures on Through-Hole Component</atitle><jtitle>Journal of electronic packaging</jtitle><stitle>J. Electron. Packag</stitle><date>2022-12-01</date><risdate>2022</risdate><volume>144</volume><issue>4</issue><issn>1043-7398</issn><eissn>1528-9044</eissn><abstract>The conventional method of selective soldering has been practiced using wave soldering, convection reflow, and hand soldering. However, due to industry automation and high demand for quality, repeatability and flexibility, laser soldering process has been developed to meet these demands. This article investigates the effect of different temperature of laser soldering process on lead-free solder (SAC305) by means of numerical method that is validated by experiment. Finite volume method (FVM) was used for the three-dimensional simulation to simulate the filling flow of the lead-free solder. Experiments were carried out to complement simulation validity and the results of both methods show good agreement. The findings show that a better result can be achieved when the angle of component lead (θle) approaches 90 deg. Using optimized lead angle, five different temperature simulations were set in the range of 550 K &lt; T &lt; 700 K. The finding shows that 600 K has the best velocity and pressure distributions with average values of 63.3 mm/s and 101.13 kPa, respectively. The high-pressure regions are concentrated at the top and bottom surface of solder pad. High difference in pressure and velocity spots somehow lead to issue associated with possibility of incomplete filling or void formation. 650 K model shows less void formation since it produces high pressure filling flow within the solder region.</abstract><pub>ASME</pub><doi>10.1115/1.4052175</doi></addata></record>
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title Influence of Laser Soldering Temperatures on Through-Hole Component
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T19%3A56%3A26IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-asme_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Influence%20of%20Laser%20Soldering%20Temperatures%20on%20Through-Hole%20Component&rft.jtitle=Journal%20of%20electronic%20packaging&rft.au=Zahiri,%20Saifulmajdy%20A.&rft.date=2022-12-01&rft.volume=144&rft.issue=4&rft.issn=1043-7398&rft.eissn=1528-9044&rft_id=info:doi/10.1115/1.4052175&rft_dat=%3Casme_cross%3E1115895%3C/asme_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true