Influence of Laser Soldering Temperatures on Through-Hole Component

The conventional method of selective soldering has been practiced using wave soldering, convection reflow, and hand soldering. However, due to industry automation and high demand for quality, repeatability and flexibility, laser soldering process has been developed to meet these demands. This article investigates the effect of different temperature of laser soldering process on lead-free solder (SAC305) by means of numerical method that is validated by experiment. Finite volume method (FVM) was used for the three-dimensional simulation to simulate the filling flow of the lead-free solder. Experiments were carried out to complement simulation validity and the results of both methods show good agreement. The findings show that a better result can be achieved when the angle of component lead (θle) approaches 90 deg. Using optimized lead angle, five different temperature simulations were set in the range of 550 K