Characterization for High-Performance CMOS Using In-Wafer Advanced Kelvin-Contact Device Structure

In this work, a new electrical characterization method for MOSFETs using an in-wafer Kelvin-contact device structure is developed. The developed method can eliminate the parasitic series resistance such as resistance in source/drain terminals of MOSFETs, in metal wires on wafers and in a measurement...

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Veröffentlicht in:IEEE transactions on semiconductor manufacturing 2009-02, Vol.22 (1), p.126-133
Hauptverfasser: Kuroda, R., Teramoto, A., Komuro, T., Sugawa, S., Ohmi, T.
Format: Artikel
Sprache:eng
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Zusammenfassung:In this work, a new electrical characterization method for MOSFETs using an in-wafer Kelvin-contact device structure is developed. The developed method can eliminate the parasitic series resistance such as resistance in source/drain terminals of MOSFETs, in metal wires on wafers and in a measurement system. Using the developed method, we can measure and analyze the short channel transistors' intrinsic current-voltage characteristics as well as the quantitative effects of the parasitic series resistance to the device performance, very stably and accurately. In addition, a framework for the characterization of inversion layer mobility in ultrathin gate insulator MOSFETs with large gate current is provided. Based on the framework, the developed method is introduced as a suitable mobility characterization method.
ISSN:0894-6507
1558-2345
DOI:10.1109/TSM.2008.2010743