Reliability improvement of rapid thermal oxide using gas switching
The instantaneous switch-off of the gas precursors during the ramp-down cycle in a spike ramp process is demonstrated to be an effective method to enhance the reliability of rapid thermal oxide. Due to the slow ramp-down rate (60/spl deg/C-90/spl deg/C/s) of a rapid thermal process, the oxidation du...
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Veröffentlicht in: | IEEE transactions on semiconductor manufacturing 2003-11, Vol.16 (4), p.656-659 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | The instantaneous switch-off of the gas precursors during the ramp-down cycle in a spike ramp process is demonstrated to be an effective method to enhance the reliability of rapid thermal oxide. Due to the slow ramp-down rate (60/spl deg/C-90/spl deg/C/s) of a rapid thermal process, the oxidation during the slow ramp-down cycle may produce the inferior oxide, especially for ultrathin oxide. To avoid the oxidation in the slow ramp-down cycle, the oxidation precursor (oxygen) is switched off during the ramp-down cycle. The reliability of resulting oxide without oxidation during the ramp-down cycle is enhanced as compared with the conventional oxide, which is still oxidized during the ramp-down cycle. |
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ISSN: | 0894-6507 1558-2345 |
DOI: | 10.1109/TSM.2003.818982 |