Reliability improvement of rapid thermal oxide using gas switching

The instantaneous switch-off of the gas precursors during the ramp-down cycle in a spike ramp process is demonstrated to be an effective method to enhance the reliability of rapid thermal oxide. Due to the slow ramp-down rate (60/spl deg/C-90/spl deg/C/s) of a rapid thermal process, the oxidation du...

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Veröffentlicht in:IEEE transactions on semiconductor manufacturing 2003-11, Vol.16 (4), p.656-659
Hauptverfasser: Min Hung Lee, Cheng-Ya Yu, Fon Yuan, Chen, K.-F., Chang-Chi Lai, Chee Wee Liu
Format: Artikel
Sprache:eng
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Zusammenfassung:The instantaneous switch-off of the gas precursors during the ramp-down cycle in a spike ramp process is demonstrated to be an effective method to enhance the reliability of rapid thermal oxide. Due to the slow ramp-down rate (60/spl deg/C-90/spl deg/C/s) of a rapid thermal process, the oxidation during the slow ramp-down cycle may produce the inferior oxide, especially for ultrathin oxide. To avoid the oxidation in the slow ramp-down cycle, the oxidation precursor (oxygen) is switched off during the ramp-down cycle. The reliability of resulting oxide without oxidation during the ramp-down cycle is enhanced as compared with the conventional oxide, which is still oxidized during the ramp-down cycle.
ISSN:0894-6507
1558-2345
DOI:10.1109/TSM.2003.818982