Hybrid Microcircuit Tape Chip Carrier Materials/Processing Trade-Offs

Hybrid Microcircuit Tape Chip Carrier Materials/Processing Trade-Offs

This paper surveys and compares several metallurgical structures and compositions used in the various reel-to-reel gang bonding processes now being implemented by high-volume semiconductor manufacturers. Various gang bonding techniques are reviewed briefly as background. Thermocompression (TC), hard...

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Veröffentlicht in:IEEE transactions on parts, hybrids, and packaging hybrids, and packaging, 1977-09, Vol.13 (3), p.257-268
Hauptverfasser: Smith, J., Stuhlbarg, S.
Format: Artikel
Sprache:eng
Schlagworte:
Bonding processes
Hybrid integrated circuits
Inorganic materials
Lead
Manufacturing processes
Metallization
Pulp manufacturing
Semiconductor device manufacture
Semiconductor materials
Welding
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Beschreibung
Zusammenfassung:This paper surveys and compares several metallurgical structures and compositions used in the various reel-to-reel gang bonding processes now being implemented by high-volume semiconductor manufacturers. Various gang bonding techniques are reviewed briefly as background. Thermocompression (TC), hard solder, and soft solder inner lead bonding processes are compared, as well as TC, welding, and solder processes for outer lead bonding to lead frames or alumina-based networks. The characteristics, advantages and disadvantages of 1, 2, 3 layer interconnect metallizations, different bump structures, TC and solder bonding processes, and various carrier materials are discussed and compared.
ISSN:0361-1000
1558-2469
DOI:10.1109/TPHP.1977.1135197