A Compact Front-End Circuit for a Monolithic Sensor in a 65 nm CMOS Imaging Technology
This paper presents the design of a front-end circuit for monolithic active pixel sensors. The circuit operates with a sensor featuring a small, low-capacitance (< 2 fF) collection electrode and is integrated in the DPTS chip, a proof-of-principle prototype of 1.5 mm × 1.5 mm including a matrix o...
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Veröffentlicht in: | IEEE transactions on nuclear science 2023-09, Vol.70 (9), p.1-1 |
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Sprache: | eng |
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Zusammenfassung: | This paper presents the design of a front-end circuit for monolithic active pixel sensors. The circuit operates with a sensor featuring a small, low-capacitance (< 2 fF) collection electrode and is integrated in the DPTS chip, a proof-of-principle prototype of 1.5 mm × 1.5 mm including a matrix of 32 × 32 pixels with a pitch of 15 μm. The chip is implemented in the 65 nm imaging technology from the Tower Partners Semiconductor Co. foundry and was developed in the framework of the EP-R&D program at CERN to explore this technology for particle detection. The front-end circuit has an area of 42 μm 2 and can operate with a power consumption as low as 12 nW. Measurements on the prototype relevant to the front-end will be shown to support its design. |
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ISSN: | 0018-9499 1558-1578 |
DOI: | 10.1109/TNS.2023.3299333 |