Total Ionizing Dose Influence on the Single-Event Multiple-Cell Upsets in 65-nm 6-T SRAM

We investigated the total ionizing dose (TID) influence on the single-event multiple-cell upsets (MCUs) in 65-nm 6-T static random-access memory and found that MCU sensitivity of the device is enhanced by TID. MCU caused by particle strike in pMOSFET (p-hits) or nMOSFET (n-hits) is distinguished by...

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Veröffentlicht in:IEEE transactions on nuclear science 2019-06, Vol.66 (6), p.892-898
Hauptverfasser: Zheng, Qiwen, Cui, Jiangwei, Lu, Wu, Guo, Hongxia, Liu, Jie, Yu, Xuefeng, Wang, Liang, Liu, Jiaqi, He, Chengfa, Ren, Diyuan, Yue, Suge, Zhao, Yuanfu, Guo, Qi
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Sprache:eng
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Zusammenfassung:We investigated the total ionizing dose (TID) influence on the single-event multiple-cell upsets (MCUs) in 65-nm 6-T static random-access memory and found that MCU sensitivity of the device is enhanced by TID. MCU caused by particle strike in pMOSFET (p-hits) or nMOSFET (n-hits) is distinguished by the MCU pattern. Analysis of MCU pattern shows that both p-hits MCU and n-hits MCU are enhanced by TID, and they have different mechanisms. Enhancement of n-hits MCU is due to the positive threshold voltage shift ( \Delta V th) of the pull-up pMOSFET, while p-hits MCU is strengthened by the increase in the equivalent resistance of p-well contacts caused by oxide-trapped charges (Not) trapped in the shallow trench isolation.
ISSN:0018-9499
1558-1578
DOI:10.1109/TNS.2018.2875451