Effect of Sputtered Seed Layer on Electrodeposited NiFe/Cu Composite Wires

In this paper, a seed-layer approach to electrodeposition of Ni 80 Fe 20 on Cu wires was developed. First, different thicknesses of Ni 80 Fe 20 were directly deposited onto the Cu wires by sputtering as a seed layer. A rotation L-holder fixture was used to hold the Cu wire during sputtering. Second, a relatively thick Ni 80 Fe 20 layer was deposited by electrodeposition onto the Cu wire with the seed layer by sputtering. The results of surface characterization on the composite wires with a seed layer showed that the surface uniformity was greatly improved, as compared to the surfaces of electrodeposited wires without a seed layer. A low coercivity of 0.5 Oe for the composite wire with a seed layer was achieved. The electrodeposited wires with seed layers performed an enhanced MI effect of 250%, in contrast to the MI effect of 160% as achieved by electrodeposited wires without a seed layer