Size Effect of Heat Transport in Microscale Gas Gap

Microscale gas gaps commonly exist in gas thermal conductance related microdevices, such as micro-hot-plate gas sensors and micro-Pirani vacuum gauges. In these devices, thermal conduction of the gas gaps is an important issue for their performance. Although simulations for size effect of the therma...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:IEEE transactions on industrial electronics (1982) 2017-09, Vol.64 (9), p.7387-7391
Hauptverfasser: Huang, Zhengxing, Wang, Jiaqi, Bai, Suyuan, Guan, Jingwei, Zhang, Fengtian, Tang, Zhenan
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Microscale gas gaps commonly exist in gas thermal conductance related microdevices, such as micro-hot-plate gas sensors and micro-Pirani vacuum gauges. In these devices, thermal conduction of the gas gaps is an important issue for their performance. Although simulations for size effect of the thermal conduction in microscale gas gaps have been carried out, experimental results are still rare. In this paper, four microhot plates that contain four gas gaps from 220 nm to 21 μm have been fabricated by a standard CMOS process and some additional post-CMOS processes. The thermal convection coefficient can be obtained as large as 1242 Wm 2 K -1 from the convection dominate 21-μm gap. The effective thermal conductivity of 220-nm gap is as low as 1.2 × 10 -3 Wm -1 K -1 . Both of them indicate that size effect of gaseous heat transport is significant in such microscale devices.
ISSN:0278-0046
1557-9948
DOI:10.1109/TIE.2016.2645892