Far-Field Prediction Using Only Magnetic Near-Field Scanning for EMI Test

Far-field prediction for electromagnetic interference (EMI) testing is achieved using only magnetic near-field on a Huygens's surface. The electrical field on the Huygens's surface is calculated from the magnetic near-field using the finite element method (FEM). Two examples are used to ve...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:IEEE transactions on electromagnetic compatibility 2014-12, Vol.56 (6), p.1335-1343
Hauptverfasser: Xu Gao, Jun Fan, Yaojiang Zhang, Kajbaf, Hamed, Pommerenke, David
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Far-field prediction for electromagnetic interference (EMI) testing is achieved using only magnetic near-field on a Huygens's surface. The electrical field on the Huygens's surface is calculated from the magnetic near-field using the finite element method (FEM). Two examples are used to verify the proposed method. The first example uses the field radiated by an infinitesimal electric dipole. The calculated results are compared with the analytical solution. In the second example, the calculated results are compared with full-wave simulation results for the radiation of a print circuit board (PCB). The validity of this method when the near-field is high-impedance field is verified as well. Sensitivity of the far field to noise in both magnitude and phase in the near-field data is also investigated. The results indicate that the proposed method is very robust to the random variation of both. The effect of using only four sides of the Huygens's box is investigated as well, revealing that, in some instances, the incomplete Huygens's box can be used to predict the far field well. The proposed method is validated using near-field measurement data taken from a sleeve dipole antenna. The error for the maximum far-field value is in only 1.3 dB.
ISSN:0018-9375
1558-187X
DOI:10.1109/TEMC.2014.2322081