Foreword Special Issue on Low-Temperature Processing of Electronic Materials for Cutting Edge Devices

Foreword Special Issue on Low-Temperature Processing of Electronic Materials for Cutting Edge Devices

Thermal budgets hinder leading-edge ultra-scaled and novel designs, and moving to reduced temperature processing is becoming an acute impediment globally.

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Bibliographische Detailangaben
Veröffentlicht in:IEEE transactions on electron devices 2021-07, Vol.68 (7), p.3138-3141
Hauptverfasser: Berger, Paul R., Hussain, Muhammad Mustafa, Iacopi, Francesca, Schulze, Jorg, Ye, Peide, Rachmady, Willy, Wen, Huang-Chun, Krishnan, Siddharth
Format: Artikel
Sprache:eng
Schlagworte:
Cutting equipment
Electronic materials
Graphene
Indium tin oxide
Low temperature
Material properties
Special issues and sections
Thermal management of electronics
Thermodynamics
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Beschreibung
Zusammenfassung:Thermal budgets hinder leading-edge ultra-scaled and novel designs, and moving to reduced temperature processing is becoming an acute impediment globally.
ISSN:0018-9383
1557-9646
DOI:10.1109/TED.2021.3083455