Degradation Behavior of Etch-Stopper-Layer Structured a-InGaZnO Thin-Film Transistors Under Hot-Carrier Stress and Illumination

Etch-stopper-layer (ESL) structured amorphous InGaZnO thin-film transistors (a-IGZO TFTs) were fabricated in this article. Degradation behavior of the a-IGZO TFTs under hot-carrier stress and illumination (HCIS) was investigated. As HCIS time increases, the transfer curve in the saturation region sh...

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Veröffentlicht in:IEEE transactions on electron devices 2021-02, Vol.68 (2), p.556-559
Hauptverfasser: Lin, Dong, Su, Wan-Ching, Chang, Ting-Chang, Chen, Hong-Chih, Tu, Yu-Fa, Zhou, Kuan-Ju, Hung, Yang-Hao, Yang, Jianwen, Lu, I-Nien, Tsai, Tsung-Ming, Zhang, Qun
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Sprache:eng
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Zusammenfassung:Etch-stopper-layer (ESL) structured amorphous InGaZnO thin-film transistors (a-IGZO TFTs) were fabricated in this article. Degradation behavior of the a-IGZO TFTs under hot-carrier stress and illumination (HCIS) was investigated. As HCIS time increases, the transfer curve in the saturation region shifts in the negative direction under the forward-operation mode, whereas it shifts in the positive direction under the reverse-operation mode. The HCIS-induced degradation behavior was attributed to charge trapping in the IGZO/ESL interface. To examine the degradation mechanism, the capacitance-voltage measurements were performed. After applying HCIS, it is found that the gate-to-drain capacitance curve shifts in the positive direction and the gate-to-source capacitance curve exhibits two-stage rises. Technology computer-aided design (TCAD) was used to simulate the electric field distribution during the stress, which also confirmed the proposed mechanism.
ISSN:0018-9383
1557-9646
DOI:10.1109/TED.2020.3047015