Investigation of Trap-Induced Threshold Voltage Instability in GaN-on-Si MISHEMTs
It is shown that an E_{\rm C} -0.90 eV trap in commercial AlGaN/GaN MISHEMTs grown on a Si (111) substrate is responsible for a −1.8-V threshold voltage ( V_{\rm T} ) instability using a combination of defect spectroscopy and double-pulsed current-voltage measurements. The E_{\rm C} -0.90 eV trap...
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creator | Sun, Wenyuan Joh, Jungwoo Krishnan, Srikanth Pendharkar, Sameer Jackson, Christine M. Ringel, Steven A. Arehart, Aaron R. |
description | It is shown that an E_{\rm C} -0.90 eV trap in commercial AlGaN/GaN MISHEMTs grown on a Si (111) substrate is responsible for a −1.8-V threshold voltage ( V_{\rm T} ) instability using a combination of defect spectroscopy and double-pulsed current-voltage measurements. The E_{\rm C} -0.90 eV trap is located in the GaN buffer and is emptied by high drain biases in pinch-off, which raises the trap above the Fermi level in the GaN buffer. This trap also exhibits both fast and slow recovery processes that are explained by the availability of free electrons throughout the depth of the GaN buffer and the trapping process that depletes the free electron concentration. TCAD modeling is used to demonstrate this process and also to show why there is not a significant increase in buffer leakage current after the large negative V_{\rm T} shift due to this trap. This demonstrates that optimizing buffer designs are critical for ideal device performance. |
doi_str_mv | 10.1109/TED.2018.2888840 |
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The <inline-formula> <tex-math notation="LaTeX">E_{\rm C} </tex-math></inline-formula>-0.90 eV trap is located in the GaN buffer and is emptied by high drain biases in pinch-off, which raises the trap above the Fermi level in the GaN buffer. This trap also exhibits both fast and slow recovery processes that are explained by the availability of free electrons throughout the depth of the GaN buffer and the trapping process that depletes the free electron concentration. TCAD modeling is used to demonstrate this process and also to show why there is not a significant increase in buffer leakage current after the large negative <inline-formula> <tex-math notation="LaTeX">V_{\rm T} </tex-math></inline-formula> shift due to this trap. This demonstrates that optimizing buffer designs are critical for ideal device performance.]]></description><identifier>ISSN: 0018-9383</identifier><identifier>EISSN: 1557-9646</identifier><identifier>DOI: 10.1109/TED.2018.2888840</identifier><identifier>CODEN: IETDAI</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Aluminum gallium nitride ; Aluminum gallium nitrides ; Buffers ; Capture process ; deep-level transient spectroscopy (DLTS) ; Electrical measurement ; Electron traps ; Free electrons ; Gallium nitrides ; GaN-on-Si ; isothermal ; Leakage current ; Logic gates ; metal-insulator-semiconductor high electron mobility transistors (MISHEMTs) ; Pulsed current ; Silicon substrates ; Stability ; Threshold voltage ; threshold voltage instability ; Transient analysis ; trap ; Voltage measurement ; Wide band gap semiconductors</subject><ispartof>IEEE transactions on electron devices, 2019-02, Vol.66 (2), p.890-895</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2019</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c291t-5569810ed7690b3dc4ab81fbea89eeadcb168a6f0ef91ce016772690639a3e773</citedby><cites>FETCH-LOGICAL-c291t-5569810ed7690b3dc4ab81fbea89eeadcb168a6f0ef91ce016772690639a3e773</cites><orcidid>0000-0002-7034-4349 ; 0000-0001-5144-8911 ; 0000-0001-9529-896X ; 0000-0002-8119-4593 ; 0000-0001-5289-9968</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/8599132$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/8599132$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Sun, Wenyuan</creatorcontrib><creatorcontrib>Joh, Jungwoo</creatorcontrib><creatorcontrib>Krishnan, Srikanth</creatorcontrib><creatorcontrib>Pendharkar, Sameer</creatorcontrib><creatorcontrib>Jackson, Christine M.</creatorcontrib><creatorcontrib>Ringel, Steven A.</creatorcontrib><creatorcontrib>Arehart, Aaron R.</creatorcontrib><title>Investigation of Trap-Induced Threshold Voltage Instability in GaN-on-Si MISHEMTs</title><title>IEEE transactions on electron devices</title><addtitle>TED</addtitle><description><![CDATA[It is shown that an <inline-formula> <tex-math notation="LaTeX">E_{\rm C} </tex-math></inline-formula>-0.90 eV trap in commercial AlGaN/GaN MISHEMTs grown on a Si (111) substrate is responsible for a −1.8-V threshold voltage (<inline-formula> <tex-math notation="LaTeX">V_{\rm T} </tex-math></inline-formula>) instability using a combination of defect spectroscopy and double-pulsed current-voltage measurements. The <inline-formula> <tex-math notation="LaTeX">E_{\rm C} </tex-math></inline-formula>-0.90 eV trap is located in the GaN buffer and is emptied by high drain biases in pinch-off, which raises the trap above the Fermi level in the GaN buffer. This trap also exhibits both fast and slow recovery processes that are explained by the availability of free electrons throughout the depth of the GaN buffer and the trapping process that depletes the free electron concentration. TCAD modeling is used to demonstrate this process and also to show why there is not a significant increase in buffer leakage current after the large negative <inline-formula> <tex-math notation="LaTeX">V_{\rm T} </tex-math></inline-formula> shift due to this trap. This demonstrates that optimizing buffer designs are critical for ideal device performance.]]></description><subject>Aluminum gallium nitride</subject><subject>Aluminum gallium nitrides</subject><subject>Buffers</subject><subject>Capture process</subject><subject>deep-level transient spectroscopy (DLTS)</subject><subject>Electrical measurement</subject><subject>Electron traps</subject><subject>Free electrons</subject><subject>Gallium nitrides</subject><subject>GaN-on-Si</subject><subject>isothermal</subject><subject>Leakage current</subject><subject>Logic gates</subject><subject>metal-insulator-semiconductor high electron mobility transistors (MISHEMTs)</subject><subject>Pulsed current</subject><subject>Silicon substrates</subject><subject>Stability</subject><subject>Threshold voltage</subject><subject>threshold voltage instability</subject><subject>Transient analysis</subject><subject>trap</subject><subject>Voltage measurement</subject><subject>Wide band gap semiconductors</subject><issn>0018-9383</issn><issn>1557-9646</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kE1LAzEQhoMoWKt3wUvAc2qy2c3HUWptF1pFunoN2d3ZNqVu6mYr9N-b0uJchmGedz5ehO4ZHTFG9VMxeRkllKlRomKk9AINWJZJokUqLtGAxhbRXPFrdBPCJpYiTZMB-sjbXwi9W9ne-Rb7Bhed3ZG8rfcV1LhYdxDWflvjL7_t7Qpw3obelm7r-gN2LZ7aN-JbsnR4kS9nk0URbtFVY7cB7s55iD5fJ8V4Rubv03z8PCdVollPskxoxSjUUmha8rpKbalYU4JVGsDWVcmEsqKh0GhWQbxXyiSigmvLQUo-RI-nubvO_-zjD2bj910bV5qECZ1yKbWOFD1RVedD6KAxu8592-5gGDVH40w0zhyNM2fjouThJHEA8I-rTGvGE_4HAytoag</recordid><startdate>20190201</startdate><enddate>20190201</enddate><creator>Sun, Wenyuan</creator><creator>Joh, Jungwoo</creator><creator>Krishnan, Srikanth</creator><creator>Pendharkar, Sameer</creator><creator>Jackson, Christine M.</creator><creator>Ringel, Steven A.</creator><creator>Arehart, Aaron R.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0002-7034-4349</orcidid><orcidid>https://orcid.org/0000-0001-5144-8911</orcidid><orcidid>https://orcid.org/0000-0001-9529-896X</orcidid><orcidid>https://orcid.org/0000-0002-8119-4593</orcidid><orcidid>https://orcid.org/0000-0001-5289-9968</orcidid></search><sort><creationdate>20190201</creationdate><title>Investigation of Trap-Induced Threshold Voltage Instability in GaN-on-Si MISHEMTs</title><author>Sun, Wenyuan ; Joh, Jungwoo ; Krishnan, Srikanth ; Pendharkar, Sameer ; Jackson, Christine M. ; Ringel, Steven A. ; Arehart, Aaron R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c291t-5569810ed7690b3dc4ab81fbea89eeadcb168a6f0ef91ce016772690639a3e773</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2019</creationdate><topic>Aluminum gallium nitride</topic><topic>Aluminum gallium nitrides</topic><topic>Buffers</topic><topic>Capture process</topic><topic>deep-level transient spectroscopy (DLTS)</topic><topic>Electrical measurement</topic><topic>Electron traps</topic><topic>Free electrons</topic><topic>Gallium nitrides</topic><topic>GaN-on-Si</topic><topic>isothermal</topic><topic>Leakage current</topic><topic>Logic gates</topic><topic>metal-insulator-semiconductor high electron mobility transistors (MISHEMTs)</topic><topic>Pulsed current</topic><topic>Silicon substrates</topic><topic>Stability</topic><topic>Threshold voltage</topic><topic>threshold voltage instability</topic><topic>Transient analysis</topic><topic>trap</topic><topic>Voltage measurement</topic><topic>Wide band gap semiconductors</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Sun, Wenyuan</creatorcontrib><creatorcontrib>Joh, Jungwoo</creatorcontrib><creatorcontrib>Krishnan, Srikanth</creatorcontrib><creatorcontrib>Pendharkar, Sameer</creatorcontrib><creatorcontrib>Jackson, Christine M.</creatorcontrib><creatorcontrib>Ringel, Steven A.</creatorcontrib><creatorcontrib>Arehart, Aaron R.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE transactions on electron devices</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Sun, Wenyuan</au><au>Joh, Jungwoo</au><au>Krishnan, Srikanth</au><au>Pendharkar, Sameer</au><au>Jackson, Christine M.</au><au>Ringel, Steven A.</au><au>Arehart, Aaron R.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Investigation of Trap-Induced Threshold Voltage Instability in GaN-on-Si MISHEMTs</atitle><jtitle>IEEE transactions on electron devices</jtitle><stitle>TED</stitle><date>2019-02-01</date><risdate>2019</risdate><volume>66</volume><issue>2</issue><spage>890</spage><epage>895</epage><pages>890-895</pages><issn>0018-9383</issn><eissn>1557-9646</eissn><coden>IETDAI</coden><abstract><![CDATA[It is shown that an <inline-formula> <tex-math notation="LaTeX">E_{\rm C} </tex-math></inline-formula>-0.90 eV trap in commercial AlGaN/GaN MISHEMTs grown on a Si (111) substrate is responsible for a −1.8-V threshold voltage (<inline-formula> <tex-math notation="LaTeX">V_{\rm T} </tex-math></inline-formula>) instability using a combination of defect spectroscopy and double-pulsed current-voltage measurements. The <inline-formula> <tex-math notation="LaTeX">E_{\rm C} </tex-math></inline-formula>-0.90 eV trap is located in the GaN buffer and is emptied by high drain biases in pinch-off, which raises the trap above the Fermi level in the GaN buffer. This trap also exhibits both fast and slow recovery processes that are explained by the availability of free electrons throughout the depth of the GaN buffer and the trapping process that depletes the free electron concentration. TCAD modeling is used to demonstrate this process and also to show why there is not a significant increase in buffer leakage current after the large negative <inline-formula> <tex-math notation="LaTeX">V_{\rm T} </tex-math></inline-formula> shift due to this trap. This demonstrates that optimizing buffer designs are critical for ideal device performance.]]></abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TED.2018.2888840</doi><tpages>6</tpages><orcidid>https://orcid.org/0000-0002-7034-4349</orcidid><orcidid>https://orcid.org/0000-0001-5144-8911</orcidid><orcidid>https://orcid.org/0000-0001-9529-896X</orcidid><orcidid>https://orcid.org/0000-0002-8119-4593</orcidid><orcidid>https://orcid.org/0000-0001-5289-9968</orcidid></addata></record> |
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subjects | Aluminum gallium nitride Aluminum gallium nitrides Buffers Capture process deep-level transient spectroscopy (DLTS) Electrical measurement Electron traps Free electrons Gallium nitrides GaN-on-Si isothermal Leakage current Logic gates metal-insulator-semiconductor high electron mobility transistors (MISHEMTs) Pulsed current Silicon substrates Stability Threshold voltage threshold voltage instability Transient analysis trap Voltage measurement Wide band gap semiconductors |
title | Investigation of Trap-Induced Threshold Voltage Instability in GaN-on-Si MISHEMTs |
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