Investigation of Trap-Induced Threshold Voltage Instability in GaN-on-Si MISHEMTs

It is shown that an E_{\rm C} -0.90 eV trap in commercial AlGaN/GaN MISHEMTs grown on a Si (111) substrate is responsible for a −1.8-V threshold voltage ( V_{\rm T} ) instability using a combination of defect spectroscopy and double-pulsed current-voltage measurements. The E_{\rm C} -0.90 eV trap...

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Veröffentlicht in:IEEE transactions on electron devices 2019-02, Vol.66 (2), p.890-895
Hauptverfasser: Sun, Wenyuan, Joh, Jungwoo, Krishnan, Srikanth, Pendharkar, Sameer, Jackson, Christine M., Ringel, Steven A., Arehart, Aaron R.
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container_issue 2
container_start_page 890
container_title IEEE transactions on electron devices
container_volume 66
creator Sun, Wenyuan
Joh, Jungwoo
Krishnan, Srikanth
Pendharkar, Sameer
Jackson, Christine M.
Ringel, Steven A.
Arehart, Aaron R.
description It is shown that an E_{\rm C} -0.90 eV trap in commercial AlGaN/GaN MISHEMTs grown on a Si (111) substrate is responsible for a −1.8-V threshold voltage ( V_{\rm T} ) instability using a combination of defect spectroscopy and double-pulsed current-voltage measurements. The E_{\rm C} -0.90 eV trap is located in the GaN buffer and is emptied by high drain biases in pinch-off, which raises the trap above the Fermi level in the GaN buffer. This trap also exhibits both fast and slow recovery processes that are explained by the availability of free electrons throughout the depth of the GaN buffer and the trapping process that depletes the free electron concentration. TCAD modeling is used to demonstrate this process and also to show why there is not a significant increase in buffer leakage current after the large negative V_{\rm T} shift due to this trap. This demonstrates that optimizing buffer designs are critical for ideal device performance.
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The <inline-formula> <tex-math notation="LaTeX">E_{\rm C} </tex-math></inline-formula>-0.90 eV trap is located in the GaN buffer and is emptied by high drain biases in pinch-off, which raises the trap above the Fermi level in the GaN buffer. This trap also exhibits both fast and slow recovery processes that are explained by the availability of free electrons throughout the depth of the GaN buffer and the trapping process that depletes the free electron concentration. TCAD modeling is used to demonstrate this process and also to show why there is not a significant increase in buffer leakage current after the large negative <inline-formula> <tex-math notation="LaTeX">V_{\rm T} </tex-math></inline-formula> shift due to this trap. 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subjects Aluminum gallium nitride
Aluminum gallium nitrides
Buffers
Capture process
deep-level transient spectroscopy (DLTS)
Electrical measurement
Electron traps
Free electrons
Gallium nitrides
GaN-on-Si
isothermal
Leakage current
Logic gates
metal-insulator-semiconductor high electron mobility transistors (MISHEMTs)
Pulsed current
Silicon substrates
Stability
Threshold voltage
threshold voltage instability
Transient analysis
trap
Voltage measurement
Wide band gap semiconductors
title Investigation of Trap-Induced Threshold Voltage Instability in GaN-on-Si MISHEMTs
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