Thermal Characterization of Electronic Packages Using the Nyquist Plot of the Thermal Impedance

Thermal Characterization of Electronic Packages Using the Nyquist Plot of the Thermal Impedance

It will be shown in this contribution that if the thermal impedance Z th (jw)of an electronic package is represented in a Nyquist plot, the curve obtained can be fitted very well to a combination of a few (n) circles, n varying between 2 and a maximum of 5. For each of these circles, it is sufficien...

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Veröffentlicht in:IEEE transactions on components and packaging technologies 2007-12, Vol.30 (4), p.660-665
Hauptverfasser: Kawka, P., De Mey, G., Vermeersch, B.
Format: Artikel
Sprache:eng
Schlagworte:
Capacitance
Current measurement
Dynamic behavior
Dynamics
Electric variables measurement
electronic package
Electronic packaging thermal management
Electronics packaging
Frequency
Impedance
Impedance measurement
Nyquist plot
Nyquist plots
Packaging
Silicon
Temperature
thermal characterization
thermal impedance
Thermal resistance
Voltage
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Beschreibung
Zusammenfassung:It will be shown in this contribution that if the thermal impedance Z th (jw)of an electronic package is represented in a Nyquist plot, the curve obtained can be fitted very well to a combination of a few (n) circles, n varying between 2 and a maximum of 5. For each of these circles, it is sufficient to know the radius and the coordinates of the center point or just three parameters. With 3n parameters the entire behavior of the impedance can be represented and consequently, the dynamic behavior as well.
ISSN:1521-3331
1557-9972
DOI:10.1109/TCAPT.2007.906308