Low-Power, Resilient Interconnection with Orthogonal Latin Squares

A reliable, energy-efficient on-chip interconnection network employing low-swing signaling can be designed by incorporating error-correcting code. Orthogonal Latin Square Code (OLSC) can protect the interconnection against transient errors, while also lowering energy consumption. When applied to a 6...

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Veröffentlicht in:IEEE design & test of computers 2011-03, Vol.28 (2), p.30-39
Hauptverfasser: Seung Eun Lee, Yoon Seok Yang, Choi, G S, Wei Wu, Iyer, R
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Yoon Seok Yang
Choi, G S
Wei Wu
Iyer, R
description A reliable, energy-efficient on-chip interconnection network employing low-swing signaling can be designed by incorporating error-correcting code. Orthogonal Latin Square Code (OLSC) can protect the interconnection against transient errors, while also lowering energy consumption. When applied to a 64-bit link using a 45-nm CMOS technology with low-swing signaling, OLSC provided up to 55% energy reduction, with only a small area overhead and no loss in reliability.
doi_str_mv 10.1109/MDT.2011.35
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fullrecord <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_crossref_primary_10_1109_MDT_2011_35</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>5739839</ieee_id><sourcerecordid>2554223021</sourcerecordid><originalsourceid>FETCH-LOGICAL-c313t-2276f5b5216e578ed068bb431f412051d3cae2705a8d2e19f977646b616ec5db3</originalsourceid><addsrcrecordid>eNpd0M9LwzAYxvEgCs7pyaOX4knQzrxNk7RHnb8GlYnOc0i7ty6ja7YkZfjf2zHx4Om9fHh5-BJyDnQEQPPb14fZKKEAI8YPyAA4z2LIITskAypTGstU8mNy4v2S0l4JMSD3hd3Gb3aL7iZ6R28ag22IJm1AV9m2xSoY20ZbExbR1IWF_bKtbqJCB9NGH5tOO_Sn5KjWjcez3zskn0-Ps_FLXEyfJ-O7Iq4YsBAniRQ1L3kCArnMcE5FVpYpgzqFhHKYs0pjIinX2TxByOtcSpGKUvS-4vOSDcnV_u_a2U2HPqiV8RU2jW7Rdl6BkJBklMm8p5f_6NJ2rl_uVQ4po8BT2aPrPaqc9d5hrdbOrLT7VkDVLqfqc6pdTsV4ry_22iDin-SS5RnL2Q-Kz263</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>914301547</pqid></control><display><type>article</type><title>Low-Power, Resilient Interconnection with Orthogonal Latin Squares</title><source>IEEE Electronic Library (IEL)</source><creator>Seung Eun Lee ; Yoon Seok Yang ; Choi, G S ; Wei Wu ; Iyer, R</creator><creatorcontrib>Seung Eun Lee ; Yoon Seok Yang ; Choi, G S ; Wei Wu ; Iyer, R</creatorcontrib><description>A reliable, energy-efficient on-chip interconnection network employing low-swing signaling can be designed by incorporating error-correcting code. Orthogonal Latin Square Code (OLSC) can protect the interconnection against transient errors, while also lowering energy consumption. When applied to a 64-bit link using a 45-nm CMOS technology with low-swing signaling, OLSC provided up to 55% energy reduction, with only a small area overhead and no loss in reliability.</description><identifier>ISSN: 0740-7475</identifier><identifier>ISSN: 2168-2356</identifier><identifier>EISSN: 1558-1918</identifier><identifier>EISSN: 2168-2364</identifier><identifier>DOI: 10.1109/MDT.2011.35</identifier><identifier>CODEN: IDTCEC</identifier><language>eng</language><publisher>Los Alamitos: IEEE Computer Society</publisher><subject>CMOS ; Crosstalk ; Decoding ; design and test ; ECC ; Encoding ; Energy consumption ; Energy use ; Error correction codes ; error-correcting code ; Errors ; Interconnection ; IP networks ; Links ; Networks ; OFDM ; OLSC ; on-chip interconnection ; orthogonal Latin square ; Reduction ; resilience and low power design ; System-on-a-chip</subject><ispartof>IEEE design &amp; test of computers, 2011-03, Vol.28 (2), p.30-39</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Mar/Apr 2011</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c313t-2276f5b5216e578ed068bb431f412051d3cae2705a8d2e19f977646b616ec5db3</citedby><cites>FETCH-LOGICAL-c313t-2276f5b5216e578ed068bb431f412051d3cae2705a8d2e19f977646b616ec5db3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/5739839$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/5739839$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Seung Eun Lee</creatorcontrib><creatorcontrib>Yoon Seok Yang</creatorcontrib><creatorcontrib>Choi, G S</creatorcontrib><creatorcontrib>Wei Wu</creatorcontrib><creatorcontrib>Iyer, R</creatorcontrib><title>Low-Power, Resilient Interconnection with Orthogonal Latin Squares</title><title>IEEE design &amp; test of computers</title><addtitle>MDT</addtitle><description>A reliable, energy-efficient on-chip interconnection network employing low-swing signaling can be designed by incorporating error-correcting code. Orthogonal Latin Square Code (OLSC) can protect the interconnection against transient errors, while also lowering energy consumption. When applied to a 64-bit link using a 45-nm CMOS technology with low-swing signaling, OLSC provided up to 55% energy reduction, with only a small area overhead and no loss in reliability.</description><subject>CMOS</subject><subject>Crosstalk</subject><subject>Decoding</subject><subject>design and test</subject><subject>ECC</subject><subject>Encoding</subject><subject>Energy consumption</subject><subject>Energy use</subject><subject>Error correction codes</subject><subject>error-correcting code</subject><subject>Errors</subject><subject>Interconnection</subject><subject>IP networks</subject><subject>Links</subject><subject>Networks</subject><subject>OFDM</subject><subject>OLSC</subject><subject>on-chip interconnection</subject><subject>orthogonal Latin square</subject><subject>Reduction</subject><subject>resilience and low power design</subject><subject>System-on-a-chip</subject><issn>0740-7475</issn><issn>2168-2356</issn><issn>1558-1918</issn><issn>2168-2364</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2011</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNpd0M9LwzAYxvEgCs7pyaOX4knQzrxNk7RHnb8GlYnOc0i7ty6ja7YkZfjf2zHx4Om9fHh5-BJyDnQEQPPb14fZKKEAI8YPyAA4z2LIITskAypTGstU8mNy4v2S0l4JMSD3hd3Gb3aL7iZ6R28ag22IJm1AV9m2xSoY20ZbExbR1IWF_bKtbqJCB9NGH5tOO_Sn5KjWjcez3zskn0-Ps_FLXEyfJ-O7Iq4YsBAniRQ1L3kCArnMcE5FVpYpgzqFhHKYs0pjIinX2TxByOtcSpGKUvS-4vOSDcnV_u_a2U2HPqiV8RU2jW7Rdl6BkJBklMm8p5f_6NJ2rl_uVQ4po8BT2aPrPaqc9d5hrdbOrLT7VkDVLqfqc6pdTsV4ry_22iDin-SS5RnL2Q-Kz263</recordid><startdate>201103</startdate><enddate>201103</enddate><creator>Seung Eun Lee</creator><creator>Yoon Seok Yang</creator><creator>Choi, G S</creator><creator>Wei Wu</creator><creator>Iyer, R</creator><general>IEEE Computer Society</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SC</scope><scope>7SP</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>JQ2</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope></search><sort><creationdate>201103</creationdate><title>Low-Power, Resilient Interconnection with Orthogonal Latin Squares</title><author>Seung Eun Lee ; Yoon Seok Yang ; Choi, G S ; Wei Wu ; Iyer, R</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c313t-2276f5b5216e578ed068bb431f412051d3cae2705a8d2e19f977646b616ec5db3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2011</creationdate><topic>CMOS</topic><topic>Crosstalk</topic><topic>Decoding</topic><topic>design and test</topic><topic>ECC</topic><topic>Encoding</topic><topic>Energy consumption</topic><topic>Energy use</topic><topic>Error correction codes</topic><topic>error-correcting code</topic><topic>Errors</topic><topic>Interconnection</topic><topic>IP networks</topic><topic>Links</topic><topic>Networks</topic><topic>OFDM</topic><topic>OLSC</topic><topic>on-chip interconnection</topic><topic>orthogonal Latin square</topic><topic>Reduction</topic><topic>resilience and low power design</topic><topic>System-on-a-chip</topic><toplevel>online_resources</toplevel><creatorcontrib>Seung Eun Lee</creatorcontrib><creatorcontrib>Yoon Seok Yang</creatorcontrib><creatorcontrib>Choi, G S</creatorcontrib><creatorcontrib>Wei Wu</creatorcontrib><creatorcontrib>Iyer, R</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Computer and Information Systems Abstracts</collection><collection>Electronics &amp; Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology &amp; Engineering</collection><collection>Engineering Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts – Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><jtitle>IEEE design &amp; test of computers</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Seung Eun Lee</au><au>Yoon Seok Yang</au><au>Choi, G S</au><au>Wei Wu</au><au>Iyer, R</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Low-Power, Resilient Interconnection with Orthogonal Latin Squares</atitle><jtitle>IEEE design &amp; test of computers</jtitle><stitle>MDT</stitle><date>2011-03</date><risdate>2011</risdate><volume>28</volume><issue>2</issue><spage>30</spage><epage>39</epage><pages>30-39</pages><issn>0740-7475</issn><issn>2168-2356</issn><eissn>1558-1918</eissn><eissn>2168-2364</eissn><coden>IDTCEC</coden><abstract>A reliable, energy-efficient on-chip interconnection network employing low-swing signaling can be designed by incorporating error-correcting code. Orthogonal Latin Square Code (OLSC) can protect the interconnection against transient errors, while also lowering energy consumption. When applied to a 64-bit link using a 45-nm CMOS technology with low-swing signaling, OLSC provided up to 55% energy reduction, with only a small area overhead and no loss in reliability.</abstract><cop>Los Alamitos</cop><pub>IEEE Computer Society</pub><doi>10.1109/MDT.2011.35</doi><tpages>10</tpages></addata></record>
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issn 0740-7475
2168-2356
1558-1918
2168-2364
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recordid cdi_crossref_primary_10_1109_MDT_2011_35
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subjects CMOS
Crosstalk
Decoding
design and test
ECC
Encoding
Energy consumption
Energy use
Error correction codes
error-correcting code
Errors
Interconnection
IP networks
Links
Networks
OFDM
OLSC
on-chip interconnection
orthogonal Latin square
Reduction
resilience and low power design
System-on-a-chip
title Low-Power, Resilient Interconnection with Orthogonal Latin Squares
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T07%3A50%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Low-Power,%20Resilient%20Interconnection%20with%20Orthogonal%20Latin%20Squares&rft.jtitle=IEEE%20design%20&%20test%20of%20computers&rft.au=Seung%20Eun%20Lee&rft.date=2011-03&rft.volume=28&rft.issue=2&rft.spage=30&rft.epage=39&rft.pages=30-39&rft.issn=0740-7475&rft.eissn=1558-1918&rft.coden=IDTCEC&rft_id=info:doi/10.1109/MDT.2011.35&rft_dat=%3Cproquest_RIE%3E2554223021%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=914301547&rft_id=info:pmid/&rft_ieee_id=5739839&rfr_iscdi=true