IEEE SA Industry Connections 3D Body Processing Working Group and IEEE P3141 Standard for 3D Body Processing--Part 2

IEEE SA Industry Connections 3D Body Processing Working Group and IEEE P3141 Standard for 3D Body Processing--Part 2

The IEEE 3D Body Processing Industry Connections Working Group (3DBP IC) brings together a diverse group of stakeholders including computer scientists, research and development personnel, 3D body scanner vendors, retailers and associated consultants, individuals from adjacent markets, and thought le...

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Veröffentlicht in:IEEE consumer electronics magazine 2020-11, Vol.9 (6), p.97-99
Hauptverfasser: McDonald, Carol, Rannow, Randy K, Pai, Dinesh, Bullas, Alice, Ballester, Alfredo
Format: Magazinearticle
Sprache:eng
Schlagworte:
Consumer electronics
Footwear
Industries
Integrated circuits
Metadata
Processing industry
R&D
Research & development
Three dimensional bodies
Three-dimensional displays
Working groups
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Zusammenfassung:The IEEE 3D Body Processing Industry Connections Working Group (3DBP IC) brings together a diverse group of stakeholders including computer scientists, research and development personnel, 3D body scanner vendors, retailers and associated consultants, individuals from adjacent markets, and thought leaders around 3D body processing technologies (3D capture, processing, storage, sharing, and virtualization).
ISSN:2162-2248
2162-2256
DOI:10.1109/MCE.2020.2997556