N-Polar GaN HEMTs in a High-Uniformity 100-mm Wafer Process With 43.6% Power-Added Efficiency and 2 W/mm at 94 GHz
We report the fabrication of N-polar GaN metal-insulator-semiconductor high-electron-mobility transistors (MIS-HEMTs) with a power-added efficiency (PAE) of 43.7% from an 8-V supply measured by load pull at 94 GHz. The devices are fabricated on 100-mm SiC substrates and exhibit excellent uniformity,...
Gespeichert in:
Veröffentlicht in: | IEEE microwave and wireless technology letters (Print) 2023-07, Vol.33 (7), p.1-0 |
---|---|
Hauptverfasser: | , , , , , , , , , , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | We report the fabrication of N-polar GaN metal-insulator-semiconductor high-electron-mobility transistors (MIS-HEMTs) with a power-added efficiency (PAE) of 43.7% from an 8-V supply measured by load pull at 94 GHz. The devices are fabricated on 100-mm SiC substrates and exhibit excellent uniformity, constituting the first report on W -band power performance across a 100-mm N-polar GaN sample. Compared with the available efficiency of N-polar GaN on SiC at 94 GHz, the devices presented here demonstrate among the highest PAE performance, while delivering a power density of 2 W/mm, competitive with highly scaled, and previously reported both Ga and N-polar devices using an 8-V power supply. |
---|---|
ISSN: | 2771-957X 2771-9588 |
DOI: | 10.1109/LMWT.2023.3263058 |