N-Polar GaN HEMTs in a High-Uniformity 100-mm Wafer Process With 43.6% Power-Added Efficiency and 2 W/mm at 94 GHz

We report the fabrication of N-polar GaN metal-insulator-semiconductor high-electron-mobility transistors (MIS-HEMTs) with a power-added efficiency (PAE) of 43.7% from an 8-V supply measured by load pull at 94 GHz. The devices are fabricated on 100-mm SiC substrates and exhibit excellent uniformity,...

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Veröffentlicht in:IEEE microwave and wireless technology letters (Print) 2023-07, Vol.33 (7), p.1-0
Hauptverfasser: Arias-Purdue, Andrea, Rowell, Petra V., King, Casey M., Carter, Andrew D., Paniagua, Andres, Shinohara, Keisuke, Bergman, Josh, Urteaga, Miguel E., Miller, Nicholas C., Elliott, Michael, Gilbert, Ryan, Herrault, Florian, Green, Daniel, Buckwalter, James F.
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Sprache:eng
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Zusammenfassung:We report the fabrication of N-polar GaN metal-insulator-semiconductor high-electron-mobility transistors (MIS-HEMTs) with a power-added efficiency (PAE) of 43.7% from an 8-V supply measured by load pull at 94 GHz. The devices are fabricated on 100-mm SiC substrates and exhibit excellent uniformity, constituting the first report on W -band power performance across a 100-mm N-polar GaN sample. Compared with the available efficiency of N-polar GaN on SiC at 94 GHz, the devices presented here demonstrate among the highest PAE performance, while delivering a power density of 2 W/mm, competitive with highly scaled, and previously reported both Ga and N-polar devices using an 8-V power supply.
ISSN:2771-957X
2771-9588
DOI:10.1109/LMWT.2023.3263058