CAVET on Bulk GaN Substrates Achieved With MBE-Regrown AlGaN/GaN Layers to Suppress Dispersion

A current aperture vertical electron transistor (CAVET) with a Mg-ion-implanted current blocking layer (CBL) and a channel regrown by plasma assisted molecular beam epitaxy (MBE), is successfully demonstrated on bulk GaN to work as a high voltage device. The fabrication of the device combined a drif...

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Veröffentlicht in:IEEE electron device letters 2012-01, Vol.33 (1), p.41-43
Hauptverfasser: Chowdhury, S., Man Hoi Wong, Swenson, B. L., Mishra, U. K.
Format: Artikel
Sprache:eng
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Zusammenfassung:A current aperture vertical electron transistor (CAVET) with a Mg-ion-implanted current blocking layer (CBL) and a channel regrown by plasma assisted molecular beam epitaxy (MBE), is successfully demonstrated on bulk GaN to work as a high voltage device. The fabrication of the device combined a drift region grown by metalorganic chemical vapor deposition (MOCVD), to hold the blocking voltage, with AlGaN/GaN layers regrown by plasma-MBE to conduct current. The device registered a maximum current of 4 kA· cm -2 under direct-current operation offering a specific on-state resistance R on - A of 2.2 mΩ·cm 2 . With 80 μs pulses applied to the gate, the devices showed no dispersion. The increased aperture length L ap resulted in the decrease in specific R on , as expected. The impact of the gate overlap to aperture L go on the leakage current was studied, where the leakage current was found to increase with a smaller overlap.
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2011.2173456