Fabrication and Characterization of Thin-Barrier \hbox\hbox\hbox HEMTs

The growth, fabrication, and performance of Al 0.5 Ga 0.5 N/AlN/GaN high-electron-mobility transistors (HEMTs) with a total barrier thickness of 7 nm are reported. An optimized surface passivation and an ohmic recess etch yield HEMTs exhibiting 0.72 S/mm peak extrinsic dc transconductance at a curre...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:IEEE electron device letters 2011-07, Vol.32 (7), p.889-891
Hauptverfasser: Felbinger, Jonathan G., Fagerlind, Martin, Axelsson, Olle, Rorsman, Niklas, Xiang Gao, Shiping Guo, Schaff, William J., Eastman, Lester F.
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The growth, fabrication, and performance of Al 0.5 Ga 0.5 N/AlN/GaN high-electron-mobility transistors (HEMTs) with a total barrier thickness of 7 nm are reported. An optimized surface passivation and an ohmic recess etch yield HEMTs exhibiting 0.72 S/mm peak extrinsic dc transconductance at a current density of 0.47 A/mm. Devices with a gate length of 90 nm achieve 78 GHz unity-current-gain frequency and up to 166 GHz maximum frequency of oscillation. The minimum noise figure at 10 GHz is 0.52 dB with an associated gain of 9.5 dB.
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2011.2143384