Wafer Level High-Speed Germanium Photodiode Array Integration

High-density germanium photodiode arrays are integrated on top of a dummy CMOS 200-mm Silicon wafer. Using a conventional available semiconductor fabrication line, the target specifications are reached with a yield exceeding 99% for several thousands of tested photodiodes with respect to bandwidth,...

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Veröffentlicht in:	IEEE journal of selected topics in quantum electronics 2011-05, Vol.17 (3), p.526-530
Hauptverfasser:	Kopp, Christophe, Ferron, Alexandre, Hartmann, Jean-Michel, Fournier, Maryse, Augendre, Emmanuel, Grosse, Philippe, Fedeli, Jean-Marc, Derks, Henk
Format:	Artikel
Sprache:	eng
Schlagworte:	Arrays Bandwidth CMOS integrated circuits Dark current Density Germanium Germanium compounds High speed hybrid integrated circuit packaging photodetectors Photodiodes Photonics Semiconductors Silicon silicon on insulator technology Wafers
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