Large-scale photonic integrated circuits

Large-scale photonic integrated circuits

100-Gb/s dense wavelength division multiplexed (DWDM) transmitter and receiver photonic integrated circuits (PICs) are demonstrated. The transmitter is realized through the integration of over 50 discrete functions onto a single monolithic InP chip. The resultant DWDM PICs are capable of simultaneou...

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Veröffentlicht in:IEEE journal of selected topics in quantum electronics 2005-01, Vol.11 (1), p.50-65
Hauptverfasser: Nagarajan, R., Joyner, C.H., Schneider, R.P., Bostak, J.S., Butrie, T., Dentai, A.G., Dominic, V.G., Evans, P.W., Kato, M., Kauffman, M., Lambert, D.J.H., Mathis, S.K., Mathur, A., Miles, R.H., Mitchell, M.L., Missey, M.J., Murthy, S., Nilsson, A.C., Peters, F.H., Pennypacker, S.C., Pleumeekers, J.L., Salvatore, R.A., Schlenker, R.K., Taylor, R.B., Huan-Shang Tsai, Van Leeuwen, M.F., Webjorn, J., Ziari, M., Perkins, D., Singh, J., Grubb, S.G., Reffle, M.S., Mehuys, D.G., Kish, F.A., Welch, D.F.
Format: Artikel
Sprache:eng
Schlagworte:
Cost engineering
Costs
Indium phosphide
Integrated circuits
Integrated optics
Integrated optoelectronics
Large scale integration
Large-scale systems
Multiplexing
optical fiber communication
Optical receivers
Optical transmitters
Photonic integrated circuits
Photonics
Receiving
Reduction
System performance
Transmitters
Wavelength division multiplexing
Wavelengths
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Beschreibung
Zusammenfassung:100-Gb/s dense wavelength division multiplexed (DWDM) transmitter and receiver photonic integrated circuits (PICs) are demonstrated. The transmitter is realized through the integration of over 50 discrete functions onto a single monolithic InP chip. The resultant DWDM PICs are capable of simultaneously transmitting and receiving ten wavelengths at 10 Gb/s on a DWDM wavelength grid. Optical system performance results across a representative DWDM long-haul link are presented for a next-generation optical transport system using these large-scale PICs. The large-scale PIC enables significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption.
ISSN:1077-260X
1558-4542
DOI:10.1109/JSTQE.2004.841721